| Title: | 高階助聽器晶片及系統-子計畫四：助聽器數位積體電路設計( III ) Digital Integrated Circuit Design for Hearing Aids |
| Authors: | 劉志尉 Liu Chih-Wei 國立交通大學電子工程學系及電子研究所 |
| Issue Date: | 2012 |
| Gov't Doc #: | NSC101-2220-E009-005 |
| URI: | http://hdl.handle.net/11536/97694 https://www.grb.gov.tw/search/planDetail?id=2639874&docId=397535 |
| Appears in Collections: | Research Plans |
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