Title: 低介電常數材料與銅製程整合之研究(I)
Study on the Integration of Low Dielectric Constant Materials and Copper Interconnect(I)
Authors: 施敏
SZE SIMON MIN
國立交通大學電子工程學系
Issue Date: 2000
Gov't Doc #: NSC89-2215-E009-098
URI: http://hdl.handle.net/11536/98517
https://www.grb.gov.tw/search/planDetail?id=583867&docId=109701
Appears in Collections:Research Plans