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- Cu/cap interface 2
- Cu/Ge/Pd Ohmic contact 1
- Cu/In bonding 1
- Cu/In interconnect 1
- Cu/In intermetallic compounds 1
- Cu/low-k interconnect reliability 2
- CU/NI墊層 1
- Cu/pHEMA 1
- Cu/SiCp composite 2
- Cu/SiCp composites 1
- Cu/SiCp 複合材料 1
- Cu/SiO2/Si 1
- Cu/Sn 1
- Cu/Sn bonding 3
- Cu/Solder Joints 1
- Cu/Ta 1
- Cu/TaN/SiOF/Si 1
- Cu/TiO□ 1
- Cu0.5Bi2Se1.5Te1.5 thin film 1
- Cu0.8Sn1.4Bi4.8Se9 1
