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Browsing by Subject Cu/cap interface
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Showing results 1 to 2 of 2
Issue Date
Title
Author(s)
1-Dec-2005
Electromigration lifetime improvement of copper interconnect by cap/dielectric interface treatment and geometrical design
Lin, MH
;
Lin, YL
;
Chen, JM
;
Yeh, MS
;
Chang, KP
;
Su, KC
;
Wang, TH
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
2005
銅導線中電遷移效應所引發之故障特性探討
林明賢
;
Ming-Hsien, Lin
;
汪大暉
;
Dr. Tahui Wang
;
電子研究所