瀏覽 的方式： 作者 Nah, Jae-Woong
顯示 1 到 2 筆資料，總共 2 筆
| 公開日期 | 標題 | 作者 |
| 2006 | Electromigration in Pb-free solder bumps with Cu column as flip chip joints | Nah, Jae-Woong; Suh, J. O.; Tu, K. N.; Yoon, Seung Wook; Chong, Chai Tai; Kripesh, V.; Su, B. R.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
| 1-三月-2007 | Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-mu m-thick Cu under-bump metallization | Nah, Jae-Woong; Chen, Kai; Tu, K. N.; Su, Bor-Rung; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering |
