三維積體電路之低溫銅與銅接合結構設計及可靠度研究

Full metadata record

DC Field	Value	Language
dc.contributor.author	郭書喬	en_US
dc.contributor.author	Kuo, Shu-Chiao	en_US
dc.contributor.author	陳冠能	en_US
dc.date.accessioned	2015-11-26T00:55:52Z	-
dc.date.available	2015-11-26T00:55:52Z	-
dc.date.issued	2015	en_US
dc.identifier.uri	http://140.113.39.130/cdrfb3/record/nctu/#GT070150103	en_US
dc.identifier.uri	http://hdl.handle.net/11536/126067	-
dc.language.iso	en_US	en_US
dc.subject	三維積體電路	zh_TW
dc.subject	銅與銅接合	zh_TW
dc.subject	Bonding	en_US
dc.subject	3-D Integration	en_US
dc.title	三維積體電路之低溫銅與銅接合結構設計及可靠度研究	zh_TW
dc.title	A Novel Direct Cu-to-Cu Bonded Structure and Reliability Investigation in 3-D Integration	en_US
dc.type	Thesis	en_US
dc.contributor.department	電子工程學系電子研究所	zh_TW
Appears in Collections:	Thesis