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dc.contributor.authorHuang, Yu-Chiehen_US
dc.contributor.authorHu, Yu-Chenen_US
dc.contributor.authorHuang, Po-Tsangen_US
dc.contributor.authorWu, Shang-Linen_US
dc.contributor.authorYou, Yan-Hueien_US
dc.contributor.authorChen, Jr-Mingen_US
dc.contributor.authorHuang, Yan-Yuen_US
dc.contributor.authorChang, Hsiao-Chunen_US
dc.contributor.authorLin, Yen-Hanen_US
dc.contributor.authorDuann, Jeng-Renen_US
dc.contributor.authorChiu, Tzai-Wenen_US
dc.contributor.authorHwang, Weien_US
dc.contributor.authorChuang, Ching-Teen_US
dc.contributor.authorChiou, Jin-Chernen_US
dc.contributor.authorChen, Kuan-Nengen_US
dc.date.accessioned2017-04-21T06:50:15Z-
dc.date.available2017-04-21T06:50:15Z-
dc.date.issued2016en_US
dc.identifier.isbn978-1-5090-0638-0en_US
dc.identifier.urihttp://hdl.handle.net/11536/134337-
dc.description.abstractLocal brain connectivity is expected to lead to new models for neurological diseases, which may in turn result in advanced understanding and better treatment. This paper presents a neural sensing microsystem integrated with TSV-embedded dissolvable mu-needles array, ENIG bonding technology, biocompatible Au-TSV flexible interposer and neural recording circuits, for neural sensing implantation. An ultra-thin film bonding approach is proposed for integration of interposer assembly. Removing bonding wire by proposed bonding technology, the dimension of neural sensing system can be minimized to reduce surgical area and promote implant success rate. The signal quality of neural recording can be significantly improved by eliminating complex signal paths with 2.5D TSV integration from neural sensing interface to neural recording circuits.en_US
dc.language.isoen_USen_US
dc.subjectTSVen_US
dc.subject2.5Den_US
dc.subjectflexibleen_US
dc.subjectinterposeren_US
dc.subjectneural sensingen_US
dc.titleIntegration of Neural Sensing Microsystem with TSV-embedded Dissolvable mu-Needles Array, Biocompatible Flexible Interposer, and Neural Recording Circuitsen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2016 IEEE SYMPOSIUM ON VLSI TECHNOLOGYen_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.identifier.wosnumberWOS:000390702200085en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper