SHIELDING EFFECT OF A DIAPHRAGM IN A PACKAGED MICROSTRIP CIRCUIT

doi:10.1109/22.382069

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DC Field	Value	Language
dc.contributor.author	CHEN, HH	en_US
dc.contributor.author	CHUNG, SJ	en_US
dc.date.accessioned	2014-12-08T15:03:25Z	-
dc.date.available	2014-12-08T15:03:25Z	-
dc.date.issued	1995-05-01	en_US
dc.identifier.issn	0018-9480	en_US
dc.identifier.uri	http://dx.doi.org/10.1109/22.382069	en_US
dc.identifier.uri	http://hdl.handle.net/11536/1959	-
dc.description.abstract	The scattering of a diaphragm in a packaged microstrip line is investigated using the mode-matching method together with the method of lines. Instead of analyzing the discontinuity in the microstrip, this paper tackles the variation of the waveguide housing, The influences of the thickness and the depth of the diaphragm on the scatterings of the dominant mode and higher-order modes are analyzed based on a comparison of the modal power distributions, Finally, the shielding effect of a pair of closely spaced diaphragms is investigated.	en_US
dc.language.iso	en_US	en_US
dc.title	SHIELDING EFFECT OF A DIAPHRAGM IN A PACKAGED MICROSTRIP CIRCUIT	en_US
dc.type	Article	en_US
dc.identifier.doi	10.1109/22.382069	en_US
dc.identifier.journal	IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES	en_US
dc.citation.volume	43	en_US
dc.citation.issue	5	en_US
dc.citation.spage	1082	en_US
dc.citation.epage	1086	en_US
dc.contributor.department	交大名義發表	zh_TW
dc.contributor.department	電信工程研究所	zh_TW
dc.contributor.department	National Chiao Tung University	en_US
dc.contributor.department	Institute of Communications Engineering	en_US
dc.identifier.wosnumber	WOS:A1995QW25200013	-
dc.citation.woscount	2	-
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