Reduced copper diffusion in layered silicate/fluorinated polyimide (6FDA-ODA) nanocomposites

Title:	Reduced copper diffusion in layered silicate/fluorinated polyimide (6FDA-ODA) nanocomposites
Authors:	Jiang, LY Wei, KH 材料科學與工程學系 Department of Materials Science and Engineering
Keywords:	copper diffusion;layered silicates;fluorinated polyimide;nanocomposites
Issue Date:	5-May-2004
Abstract:	The copper diffusion barrier properties of layered silicate/fluorinated polyimide nanocomposites were analyzed by transmission electron microscopy (TEM) and secondary ion mass spectrometry (SIMS). It was found that the particles of copper are effectively retarded from penetrating into the polyimide matrix by layered silicates. The diffusion coefficients of layered silicate/polyimide nanocomposites are lower than that of the pure polyimide. (C) 2004 Wiley Periodicals, Inc.
URI:	http://dx.doi.org/10.1002/app.13676 http://hdl.handle.net/11536/26786
ISSN:	0021-8995
DOI:	10.1002/app.13676
Journal:	JOURNAL OF APPLIED POLYMER SCIENCE
Volume:	92
Issue:	3
Begin Page:	1422
End Page:	1425
Appears in Collections:	Articles

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APA	Jiang, L., & Wei, K. (2004). Reduced copper diffusion in layered silicate/fluorinated polyimide (6FDA-ODA) nanocomposites. WOS:000220435000006.
Bibtex	@article{Jiang2004Reduced, title={Reduced copper diffusion in layered silicate/fluorinated polyimide (6FDA-ODA) nanocomposites}, author={Jiang, LY and Wei, KH}, journal={WOS:000220435000006}, year={2004}, url={https://ir.lib.nycu.edu.tw/handle/11536/26786}, }