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dc.contributor.authorJiang, LYen_US
dc.contributor.authorWei, KHen_US
dc.date.accessioned2014-12-08T15:39:12Z-
dc.date.available2014-12-08T15:39:12Z-
dc.date.issued2004-05-05en_US
dc.identifier.issn0021-8995en_US
dc.identifier.urihttp://dx.doi.org/10.1002/app.13676en_US
dc.identifier.urihttp://hdl.handle.net/11536/26786-
dc.description.abstractThe copper diffusion barrier properties of layered silicate/fluorinated polyimide nanocomposites were analyzed by transmission electron microscopy (TEM) and secondary ion mass spectrometry (SIMS). It was found that the particles of copper are effectively retarded from penetrating into the polyimide matrix by layered silicates. The diffusion coefficients of layered silicate/polyimide nanocomposites are lower than that of the pure polyimide. (C) 2004 Wiley Periodicals, Inc.en_US
dc.language.isoen_USen_US
dc.subjectcopper diffusionen_US
dc.subjectlayered silicatesen_US
dc.subjectfluorinated polyimideen_US
dc.subjectnanocompositesen_US
dc.titleReduced copper diffusion in layered silicate/fluorinated polyimide (6FDA-ODA) nanocompositesen_US
dc.typeArticleen_US
dc.identifier.doi10.1002/app.13676en_US
dc.identifier.journalJOURNAL OF APPLIED POLYMER SCIENCEen_US
dc.citation.volume92en_US
dc.citation.issue3en_US
dc.citation.spage1422en_US
dc.citation.epage1425en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000220435000006-
dc.citation.woscount1-
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