多層印刷電路板中之嵌入式被動元件特性分析

Full metadata record

DC Field	Value	Language
dc.contributor.author	吳霖？	en_US
dc.contributor.author	WU LIN-KUN	en_US
dc.date.accessioned	2014-12-13T10:36:05Z	-
dc.date.available	2014-12-13T10:36:05Z	-
dc.date.issued	2000	en_US
dc.identifier.govdoc	NSC89-2213-E009-196	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/93770	-
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=582638&docId=109402	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	多層印刷電路板中之嵌入式被動元件特性分析	zh_TW
dc.title	Characterization of Embedded Passives on Multiplayer PCB	en_US
dc.type	Plan	en_US
dc.contributor.department	國立交通大學電信工程學系	zh_TW
Appears in Collections:	Research Plans

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