| 標題: | 微機電系統校際整合研究---子計畫三：玻璃結合及感測器之評估 Sub-Project: Glass Bonding and Evaluation of Sensor Performance |
| 作者: | 黃宇中 HUANG YU-CHUNG 國立交通大學電子工程學系 |
| 關鍵字: | 陽極結合;測試;感測器;Anodic bonding;Testing;Sensor |
| 公開日期: | 1996 |
| 官方說明文件#: | NSC85-2215-E009-031 |
| URI: | http://hdl.handle.net/11536/96027 https://www.grb.gov.tw/search/planDetail?id=234610&docId=43066 |
| 顯示於類別： | 研究計畫 |
- 矽薄膜式電熱制動微閥 / 陳建宏;Chen, Chien-Hung;張國明;Kow-Ming Chang
- 微機電系統校際整合研究---總計畫 / 張國明;CHANG KOW-MING
- Wafer bonding by low-temperature soldering / Lee, C;Huang, WF;Shie, JS
- A wafer-level hermetic encapsulation for MEMS manufacture application / Liang, Zhi-Hao;Cheng, Yu-Ting;Hsu, Wensyang;Lee, Yuh-Wen
- 表面粗糙度對奈米級封裝的效應研究 / 楊佳曄;Yang Chia-Yeh;徐文祥;鄭裕庭;Cheng Yu-Ting
- Development of low-temperature wafer level vacuum packaging for microsensors / Huang, WF;Shie, JS;Lee, C;Gong, SC;Peng, CJ
- Structural fabrication of a ring-type motion sensor / Weng, JH;Chieng, WH;Lai, JM
- 振動式環形微陀螺儀接合製程 / 鄭斌佐;Pin-Tso Cheng;成維華;Wei-Hua Chieng
- Fully process-compatible layout design on bond pad to improve wire bond reliability in CMOS ICs / Ker, MD;Peng, JJ
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