Browsing by Author "An, Chao-Chyun"

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Electrical characterization of fine-pitch compliant bumps
(2009)
Lin, C. K.
;
Chen, Chih
;
Chang, Shyh-Ming
;
An, Chao-Chyun
;
Lee, Hsiao Ting
The electrical characterization of fine-pitch compliant Au bumps is investigated in this study. Compliant Au bumps of 20 microns pitch were fabricated on a glass substrate for chip-on-glass application. Kelvin probes are fabricated and employed to measure the bump resistance. The resistance ranges from 1.0 to 4.5 ohms, depending on process parameters. Current-carrying capability for these bumps is examined. Electromigration test is performed and it is found that the failure occurs in the wiring Al line on the glass substrate, indicating that the Au bumps have high electromigration resistance. The bump resistance is also measured during thermal cycling from 30 to 110 degrees C, and the resistance increases less than 50 % after 6 cycles. Aging test is also carried out at 60 degrees C and 40 mA, and the failure time is 561 hours.
Electrical characterization of fine-pitch compliant bumps
(2008)
Lin, C. K.
;
Chen, Chih
;
Chang, Shyh-Ming
;
An, Chao-Chyun
;
Lee, Hsiao Ting
The electrical characterization of fine-pitch compliant Au bumps is investigated in this study. Compliant Au bumps of 20 microns pitch were fabricated on a glass substrate for chip-on-glass application. Kelvin probes are fabricated and employed to measure the bump resistance. The resistance ranges from 1.0 to 4.5 ohms, depending on process parameters. Current-carrying capability for these bumps is examined. Electromigration test is performed and it is found that the failure occurs in the wiring Al line on the glass substrate, indicating that the Au bumps have high electromigration resistance. The bump resistance is also measured during thermal cycling from 30 to 110 degrees C, and the resistance increases less than 50% after 6 cycles. Aging test is also carried out at 60 degrees C and 40 mA, and the failure time is 561 hours.
Experimental study of demolding properties on stereolithography tooling
(2007-08-01)
An, Chao-Chyun
;
Chen, Ren-Haw
;
機械工程學系
;
Department of Mechanical Engineering
Direct tooling using stereolithography (SL) photopolymer has been developed as rapid tooling for short-run injection molds. However, the tool strength, thermal conductivity, and erosion resistance of SL mold are lower than that of the conventional metal mold. Previous study has showed that the tool life was limited under 200 shots and tool damage often occurs during part ejection. In this paper, experimental data from a demolding properties test are presented and discussed. The experiments were performed using various cooling time, hold pressure, and mold temperature. The experimental data were analyzed by measuring demolding force and surface roughness to evaluate tool life and failure mechanism in order to obtain a working range for the process parameters. The test result shows that the demolding force has close relation with cooling time and mold temperature.
Fine pitch "NCF-type Compliant-bumped COG"
(2007)
An, Chao-Chyun
;
Chang, Shyh-Ming
;
Chen, Ming-Yao
;
Kao, Kuo-Shu
;
Tsang, Jimmy
Non-Conductive-Film (NCF) type of Chip-on-Glass (COG) bonding method ensures the micro-order direct bonding between the IC electrode and glass substrate electrode. The binding force of the applied adhesive achieves electrical connections between the bumps on the IC chip and the electrodes on the glass substrate. The mathematical calculation results of bump stress and bump deformation are used to identify the environmental temperature range for the given COG bonding structure. Both of the calculation and experimental results demonstrate the feasibility of using the compliant bumps to achieve a high compressive stress, high bump deformation and low as well as stable connection resistance at various environmental temperatures. The 1,000 hrs 85 degrees C/85%RH reliability test result will be indicated.
The brand-new high density "NCF=-type compliant-bumped COG" in high resolution LCD
(2007-01-01)
Chang, Shyh-Ming
;
Kao, Kuo-Shu
;
An, Chao-Chyun
;
Chen, Ming-Yao
;
Tsang, Jimmy
Non-Conductive-Film (NCF) bonding method ensures the micro-order direct bonding between the IC electrode and circuit substrate electrode. The binding force of the applied adhesive achieves electrical connections between the bumps on the IC chip and the electrodes on the substrate. The stress analysis results are used to identify the appropriate temperature range for the given NCF bonding structure. Both analytical and experimental results demonstrate the feasibility of using the compliant bumps to achieve a high compressive stress and low as well as stable connection resistance at various environmental temperatures.
The experimental study on the defects occurrence of SL mold in injection molding
(2008-05-26)
An, Chao-Chyun
;
Chen, Ren-Haw
;
機械工程學系
;
Department of Mechanical Engineering
Past experience has shown that the defects occurrence in injection-molded parts of metal mold included weld line, flow mark and solid skin. In this study, a thin wall cavity is designed as flow path for plastic injection mold. The injection molding tests were performed by using metal mold and stereolithography (SL) mold to compare with the flow behavior and defects occurrence of flat parts. The experiments were performed with various process parameters to investigate the defects occurrence in the injection-molded parts. The experimental results showed that defects occurrence has close relation with injection speeds and mold temperatures. Flow marks of SL mold occur more easily when the mold temperature and the injection speed are low. Moreover, the injection-molded parts were examined whether the surface defects (flow mark and weld line) occurred and analyzed as the reference for the future SL mold design. (C) 2007 Elsevier B.V. All rights reserved.
Theoretical stress calculation and experimental results of "NCF-type compliant-bumped COG"
(2007)
Chen, Ming-Yao
;
An, Chao-Chyun
;
Chang, Shyh-Ming
;
Kao, Kuo-Shu
;
Tsang, Jimmy
Non-Conductive-Film (NCF) bonding method ensures the micro-order direct bonding between the IC electrode and circuit substrate electrode. The binding force of the applied adhesive achieves electrical connections between the bumps on the IC chip and the electrodes on the substrate. The stress analysis results are used to identify the appropriate temperature range for the given NCF bonding structure. Both analytical and experimental results demonstrate the feasibility of using the compliant bumps to achieve a high compressive stress and low, and stable connection resistance at various environmental temperatures. In addition, the reliability test results will be discussed.