Browsing by Author "Bo, Tain-Cih"

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Effect of NH3/N-2 ratio in plasma treatment on porous low dielectric constant SiCOH materials
(2014-05-01)
Huang, Jun-Fu
;
Bo, Tain-Cih
;
Chang, Wei-Yuan
;
Chang, Yu-Min
;
Leu, Jihperng
This study investigates the effect of the NH3/N-2 ratio in plasma treatment on the physical and electrical properties as well as the reliability characteristics of porous low-k films. All of the plasma treatments resulted in the formation of a thin and modified layer on the surface of porous low-k films, and the properties of this modified layer were influenced by the NH3/N-2 ratio in the plasma. Experimental results indicated that pure N-2 gas plasma treatment formed an amide-like/nitride-like layer on the surface, which apparently leads to a higher increase in the dielectric constant. Plasma treatment with a mixture of NH3/N-2 gas induced more moisture uptake on the surface of the low-k dielectric, degrading the electrical performance and reliability. Among all plasma treatment with NH3/N-2 mixed gas, that with pure NH3 gas yielded low-k dielectrics with the worse electrical and reliability characteristics. (C) 2014 American Vacuum Society.