Browsing by Author "Brammertz, G."

Now showing 1 - 8 of 8

Defect density reduction of the Al(2)O(3)/GaAs(001) interface by using H(2)S molecular beam passivation
(2011-10-01)
Merckling, C.
;
Chang, Y. C.
;
Lu, C. Y.
;
Penaud, J.
;
Brammertz, G.
The integration of higher carrier mobility materials to increase drive current capability in the next CMOS generations is required for device scaling. But a fundamental issue regarding the introduction of high-mobility III-V in CMOS is the electrical passivation of the interface with the high-kappa gate dielectric. In this work, we show that in situ H(2)S surface treatment on GaAs(001) leads to a stable and reorganized oxide/III-V interface. The exposition of the GaAs surface is monitored in situ by RHEED and the interface is characterized by XPS analyses. Finally, MOS capacitors are fabricated to extract interface state density over the band gap. These results highlight a promising re-interest in chalcogenide passivation of III-V surfaces for CMOS applications. (C) 2011 Elsevier B.V. All rights reserved.
Defect density reduction of the Al2O3/GaAs(001) interface by using H2S molecular beam passivation
(2011-10-01)
Merckling, C.
;
Chang, Y. C.
;
Lu, C. Y.
;
Penaud, J.
;
Brammertz, G.
The integration of higher carrier mobility materials to increase drive current capability in the next CMOS generations is required for device scaling. But a fundamental issue regarding the introduction of high-mobility III-V in CMOS is the electrical passivation of the interface with the high-kappa gate dielectric. In this work, we show that in situ H2S surface treatment on GaAs(001) leads to a stable and reorganized oxide/III-V interface. The exposition of the GaAs surface is monitored in situ by RHEED and the interface is characterized by XPS analyses. Finally, MOS capacitors are fabricated to extract interface state density over the band gap. These results highlight a promising re-interest in chalcogenide passivation of III-V surfaces for CMOS applications. (C) 2011 Elsevier B.V. All rights reserved.
Electrical Characterization of Al(2)O(3)/n-InAs Metal-Oxide-Semiconductor Capacitors With Various Surface Treatments
(2011-06-01)
Trinh, H. D.
;
Brammertz, G.
;
Chang, E. Y.
;
Kuo, C. I.
;
Lu, C. Y.
Ex situ sulfide and HCl wet chemical treatments in conjunction with in situ trimethyl aluminum (TMA) pretreatment were performed before the deposition of Al(2)O(3) on n-InAs surfaces. X-ray photoelectron spectroscopy analyses show a significant reduction of InAs native oxides after different treatments. The capacitance-voltage C-V characterization of Al(2)O(3)/n-InAs structures shows that the frequency dispersion in the accumulation regime is small (< 0.75%/dec) and does not seem to be significantly affected by the different surface treatments, whereas the latter improves depletion and inversion behaviors of the n-channel metal-oxide-semiconductor capacitors. The interface trap density profiles extracted from the simulation mainly show donorlike interface states inside the InAs band gap and in the lower part of the conduction band. The donorlike traps inside the InAs band gap and in the lower part of the conduction band were significantly reduced by using wet-chemical-plus-TMA treatments, in agreement with C-V characteristics.
Electrical Characterization of Al2O3/n-InAs Metal-Oxide-Semiconductor Capacitors With Various Surface Treatments
(2011-06-01)
Trinh, H. D.
;
Brammertz, G.
;
Chang, E. Y.
;
Kuo, C. I.
;
Lu, C. Y.
Ex situ sulfide and HCl wet chemical treatments in conjunction with in situ trimethyl aluminum (TMA) pretreatment were performed before the deposition of Al2O3 on n-InAs surfaces. X-ray photoelectron spectroscopy analyses show a significant reduction of InAs native oxides after different treatments. The capacitance-voltage C-V characterization of Al2O3/n-InAs structures shows that the frequency dispersion in the accumulation regime is small (< 0.75%/dec) and does not seem to be significantly affected by the different surface treatments, whereas the latter improves depletion and inversion behaviors of the n-channel metal-oxide-semiconductor capacitors. The interface trap density profiles extracted from the simulation mainly show donorlike interface states inside the InAs band gap and in the lower part of the conduction band. The donorlike traps inside the InAs band gap and in the lower part of the conduction band were significantly reduced by using wet-chemical-plus-TMA treatments, in agreement with C-V characteristics.
Experimental and modeling on atomic layer deposition Al2O3/n-InAs metal-oxide-semiconductor capacitors with various surface treatments
(2011-01-01)
Trinh, H. D.
;
Chang, E. Y.
;
Brammertz, G.
;
Lu, C. Y.
;
Nguyen, H. Q.
Ex-situ sulfide and HCl wet chemical treatments in conjunction with in-situ trimethyl aluminum (TMA) pretreatment were performed before the deposition of Al2O3 on n-InAs surfaces. X-ray photoelectron spectroscopy analyses show a significant reduction of InAs native oxides after different treatments. Capacitance-voltage (C-V) characterization of Al2O3/n-InAs structures shows that the frequency dispersion in accumulation regime is small (<0.75% per decade) and does not seem to be affected significantly by the different surface treatments, whereas the latter improves depletion and inversion behaviors of the nMOS capacitors. The interface trap density profiles extracted from simulation show mainly donor-like interface states inside the InAs bandgap and in the lower part of the conduction band. The donor-like traps inside the InAs bandgap and in the lower part of the conduction band were significantly reduced by using wet chemical plus TMA treatments, in agreement with C-V characteristics.
Experimental and modeling on atomic layer deposition Al2O3/n-InAs metal-oxide-semiconductor capacitors with various surface treatments
(2011-01-01)
Trinh, H. D.
;
Chang, E. Y.
;
Brammertz, G.
;
Lu, C. Y.
;
Nguyen, H. Q.
Ex-situ sulfide and HCl wet chemical treatments in conjunction with in-situ trimethyl aluminum (TMA) pretreatment were performed before the deposition of Al2O3 on n-InAs surfaces. X-ray photoelectron spectroscopy analyses show a significant reduction of InAs native oxides after different treatments. Capacitance-voltage (C-V) characterization of Al2O3/n-InAs structures shows that the frequency dispersion in accumulation regime is small (<0.75% per decade) and does not seem to be affected significantly by the different surface treatments, whereas the latter improves depletion and inversion behaviors of the nMOS capacitors. The interface trap density profiles extracted from simulation show mainly donor-like interface states inside the InAs bandgap and in the lower part of the conduction band. The donor-like traps inside the InAs bandgap and in the lower part of the conduction band were significantly reduced by using wet chemical plus TMA treatments, in agreement with C-V characteristics.
H(2)S molecular beam passivation of Ge(001)
(2011-04-01)
Merckling, C.
;
Chang, Y. C.
;
Lu, C. Y.
;
Penaud, J.
;
El-Kazzi, M.
A fundamental issue regarding the introduction of high-mobility Ge channels in CMOS circuits is the electrical passivation of the interface with the high-k gate dielectric. In this paper, we investigate the passivation of p-Ge(0 0 1) using molecular H(2)S. The modification of the semiconductor surface is monitored in situ by RHEED and the interface is characterized by XPS analyses. MOS capacitors are fabricated to extract interface state density, and finally we demonstrate the efficiency of the passivation scheme using a combination with an ultra thin Al interlayer. (C) 2010 Elsevier B.V. All rights reserved.
H2S molecular beam passivation of Ge(001)
(2011-04-01)
Merckling, C.
;
Chang, Y. C.
;
Lu, C. Y.
;
Penaud, J.
;
El-Kazzi, M.
A fundamental issue regarding the introduction of high-mobility Ge channels in CMOS circuits is the electrical passivation of the interface with the high-k gate dielectric. In this paper, we investigate the passivation of p-Ge(0 0 1) using molecular H2S. The modification of the semiconductor surface is monitored in situ by RHEED and the interface is characterized by XPS analyses. MOS capacitors are fabricated to extract interface state density, and finally we demonstrate the efficiency of the passivation scheme using a combination with an ultra thin Al interlayer. (C) 2010 Elsevier B.V. All rights reserved.