Browsing by Author "Chang, KH"
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Item type:Item, iMail: a WAP mail retrieving system(2003-05-01) ;Rao, H ;Cheng, YH ;Chang, KH ;Lin, YB資訊工程學系This paper proposes iMail, a WAP mail retrieving system designed for wireless handheld devices to access Internet email service. In mobile data networks, the communication bandwidth is limited and the wireless handsets are constrained by small display, powerless CPU, limited memory, and unhandy input/output interface. To support mail retrieving in a mobile environment, we implement several features for iMail: mail filtering, two-phase fetch and pre-defined list reordering. Based on the user's filter options, mail filtering eliminates non-necessary mails sent to a wireless handheld device. Two-phase fetch is used to reduce transmission overhead of message delivery. We use pre-defined list reordering to speed up text typing in the wireless handheld devices. We also propose three mail notification mechanisms for iMail. When a new mail arrives, the mail notification mechanism informs iMail users immediately. Through the descriptions of the iMail features, this paper provides design and implementation guidelines for WAP applications. (C) 2002 Elsevier Science Inc. All rights reserved.Item type:Item, Spatially resolving the hot carrier degradations of poly-Si thin-film transistors using a novel test structure(2006-07-01) ;Lin, HC ;Lee, MH ;Chang, KH ;電子工程學系及電子研究所Department of Electronics Engineering and Institute of ElectronicsA novel thin-film transistor test structure is proposed for monitoring the device hot-carrier (HQ degradations. The new test structure consists of several source/drain electrode pairs arranged in the direction perpendicular to the normal (i.e., lateral) channel of the test transistor. This unique feature allows, for the first time, the study of spatial resolution of HC degradations along the channel of the test transistor after stressing. The extent of degradation as well as the major degradation mechanisms along the channel of the test transistor can be clearly identified.Item type:Item, The epoxy-polycarbonate blends cured with aliphatic amine .1. Mechanism and kinetics(1997-09-30) ;Lin, ML ;Chang, KH ;Chang, FC ;Li, MSMa, CCMReaction mechanism of the PC-epoxy blends cured by aliphatic amine has been investigated by varying PC contents in the blends. The transamidation reaction tends to convert nearly all the carbonates into N-aliphatic aromatic carbamates even at ambient temperature before normal curing. The remaining amine proceeds the normal curing with epoxy at a higher temperature (80 degrees C). For the PC-epoxy/aliphatic amine blend containing 6 wt % PC, the yielded N-aliphatic aromatic carbamate further reacts with amine to produce the urea structure. The urea undergoes substitution reaction with the hydroxyl formed from the normal curing to give the N-aliphatic aliphatic carbamate. For the blend containing 12 wt % PC, the N-aliphatic aromatic carbamate converts into the N-aliphatic aliphatic carbamate via two different routes. For the blend containing lower molecular weight of the aliphatic amine, the N-aliphatic aromatic carbamate reacts with hydroxyl to form the N-aliphatic aliphatic carbamate directly. For the blend containing higher molecular weight of aliphatic amine, the N-aliphatic aromatic carbamate decomposes into the aliphatic isocyanate accelerated by the presence of the residual oxirane. The isocyanate formed then reacts with hydroxyl to yield the N-aliphatic aliphatic carbamate. The activation energy (E-alpha) and preexponential factor (A) of the PC-epoxy/POPDA blends decrease with the increase of the PC content. Kinetic study by thermal analysis by the method of autocatalyzed model is able to correctly predict oxirane conversion vs. time relationship for the neat epoxy/aliphatic amine and the PC-epoxy/aromatic amine systems because the dominant reaction is the normal curing reaction between amine and oxirane. The model fails to predict the PC-epoxy/aliphatic amine system because the system is complicated by several other reactions besides the normal curing reaction. (C) 1997 John Wiley & Sons, Inc.Item type:Item, The epoxy-polycarbonate blends cured with aliphatic amine .1. Mechanism and kinetics(1997-09-30) ;Lin, ML ;Chang, KH ;Chang, FC ;Li, MSMa, CCMReaction mechanism of the PC-epoxy blends cured by aliphatic amine has been investigated by varying PC contents in the blends. The transamidation reaction tends to convert nearly all the carbonates into N-aliphatic aromatic carbamates even at ambient temperature before normal curing. The remaining amine proceeds the normal curing with epoxy at a higher temperature (80 degrees C). For the PC-epoxy/aliphatic amine blend containing 6 wt % PC, the yielded N-aliphatic aromatic carbamate further reacts with amine to produce the urea structure. The urea undergoes substitution reaction with the hydroxyl formed from the normal curing to give the N-aliphatic aliphatic carbamate. For the blend containing 12 wt % PC, the N-aliphatic aromatic carbamate converts into the N-aliphatic aliphatic carbamate via two different routes. For the blend containing lower molecular weight of the aliphatic amine, the N-aliphatic aromatic carbamate reacts with hydroxyl to form the N-aliphatic aliphatic carbamate directly. For the blend containing higher molecular weight of aliphatic amine, the N-aliphatic aromatic carbamate decomposes into the aliphatic isocyanate accelerated by the presence of the residual oxirane. The isocyanate formed then reacts with hydroxyl to yield the N-aliphatic aliphatic carbamate. The activation energy (E-alpha) and preexponential factor (A) of the PC-epoxy/POPDA blends decrease with the increase of the PC content. Kinetic study by thermal analysis by the method of autocatalyzed model is able to correctly predict oxirane conversion vs. time relationship for the neat epoxy/aliphatic amine and the PC-epoxy/aromatic amine systems because the dominant reaction is the normal curing reaction between amine and oxirane. The model fails to predict the PC-epoxy/aliphatic amine system because the system is complicated by several other reactions besides the normal curing reaction. (C) 1997 John Wiley & Sons, Inc.Item type:Item, The epoxy-polycarbonate blends cured with aliphatic amine .2. Thermal and mechanical properties mechanisms(1997-09-30) ;Lin, ML ;Chang, KH ;Chang, FC ;Li, MSMa, CCMThe transamidation reaction converts the carbonate and amine into N-aliphatic aromatic carbamate and urea, causing the equivalent of oxirane and amine nonstoichiometric in the primary cure stage. After postcure, the substitution reaction takes place and results in a more tightly crosslinked structure. Such a higher crosslinking density is responsible for higher T-g, tensile strength, and tensile modulus in the postcure stage than that in the primary and secondary cure stages. This trend is more pronounced in those PC-epoxy blends containing higher molecular weight aliphatic amine or a higher content of PC. This phenomenon is due to the difference in the fraction of amino group of aliphatic amine consumed in the transamidation. PC-epoxy/aliphatic amine blends show minor improvement in the high strain rate Izod impact tests, while toughness improvement for some blends is substantial at low strain rate tensile tests. (C) 1997 John Wiley & Sons, Inc.Item type:Item, The epoxy-polycarbonate blends cured with aliphatic amine .2. Thermal and mechanical properties mechanisms(1997-09-30) ;Lin, ML ;Chang, KH ;Chang, FC ;Li, MSMa, CCMThe transamidation reaction converts the carbonate and amine into N-aliphatic aromatic carbamate and urea, causing the equivalent of oxirane and amine nonstoichiometric in the primary cure stage. After postcure, the substitution reaction takes place and results in a more tightly crosslinked structure. Such a higher crosslinking density is responsible for higher T-g, tensile strength, and tensile modulus in the postcure stage than that in the primary and secondary cure stages. This trend is more pronounced in those PC-epoxy blends containing higher molecular weight aliphatic amine or a higher content of PC. This phenomenon is due to the difference in the fraction of amino group of aliphatic amine consumed in the transamidation. PC-epoxy/aliphatic amine blends show minor improvement in the high strain rate Izod impact tests, while toughness improvement for some blends is substantial at low strain rate tensile tests. (C) 1997 John Wiley & Sons, Inc.