Browsing by Author "Chang, Y. J."

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400Mbit/s OOK green-LED visible light communication with low illumination
(2018-12-01)
Yeh, C. H.
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Chow, C. W.
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Gu, C. S.
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Guo, B. S.
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Chang, Y. J.
In this work, we propose and demonstrate a LED-based visible light communication (VLC) system. Here, an analog front end (AFE) circuit with optimal equalization design is investigated to enhance the modulation bandwidth of LED. The VLC data rates of 340Mbit/s can be achieved under 1.5-3m free space transmissions with error-free (bit error ratio, BER<1x10(-9)). When the traffic rate is increased to 400Mbit/s, the BER satisfying the forward error correction (FEC) limit (BER=3.8x10(-3)) can be achieved at the low illumination of 34.1 Lux.
Electrical Performances and Quality Investigations of Integrated Bonded Structures and TSVs for 3D Interconnects
(2012)
Chen, K. N.
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Chang, Y. J.
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Ko, C. T.
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Hsu, S. Y.
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Chen, H. Y.
Novel Design of Interactive Caption and Recognition Postures within the Wearable and Non-Vision System over Wireless Sensor Network
(2010)
Huang, W. T.
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Hung, C. N.
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Tuan, C. C.
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Chen, C. C.
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Chang, Y. J.
In this study, we design and present the novel wearable system with the interactive posture caption and recognition functions based on the non-vision over the ZigBee wireless sensor network (ZigBee-WSN). There are two type sensors, 3-axis accelerometer and clip type, to be employed in our wearable system. These sensors are arranged on user\'s four limbs such that the posture information can be gathered by them. Then, the posture information is transmitted to the data-controlling center over ZigBee-WSN. Finally, this center can analyze and distinguish various postures by our proposed algorithm through the friend user\'s interface to express. Our presented wearable system can distinguish out 28 kinds of hand postures and 13 kinds of leg postures altogether. Moreover, under our presented ZigBee-WSN system with small size, low-power consumption, and high-reliability characteristics, the data-controlling center can simultaneously tele-monitor the real-time body interactive postures of 8 persons, when the transmitting distance is less than 18 M and the package correct transmitted rate is more than 97.5%.
Single-mode erbium fiber dual-ring laser with 60-nm workable wavelength tunability
(2019-06-01)
Yang, Y. L.
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Yeh, C. H.
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Tsai, C. K.
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Xie, Y. R.
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Lue, C. M.
In this investigation, to reach a widely wavelength-selectable and stable single-longitudinal-mode (SLM) erbium-doped fiber (EDF) ring laser, the unpumped EDF-based saturable absorber (SA) and dual-ring structure are used simultaneously for thickly multi-longitudinal-mode (MLM) suppression. The dual-ring scheme can spread the operation range of gain medium from 1520.0 to 1580.0 nm only by using a C-band erbium-doped fiber amplifier (EDFA). Moreover, the dual-ring scheme and EDF-based SA also could suppress the MLM noise for SLM oscillation. In the tuning range, the Lorentzian 3 dB linewidth is also obtained between 15 and 22 kHz in the wavelength range.
Structural Design, Process, and Reliability of a Wafer-Level 3D Integration Scheme with Cu TSVs Based on Micro-bump/Adhesive Hybrid Wafer Bonding
(2012)
Ko, C. T.
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Hsiao, Z. C.
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Chang, Y. J.
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Chen, P. S.
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Huang, J. H.
In this study, a wafer-level 3D integration scheme with Cu TSVs based on Cu/Sn micro-bump and BCB adhesive hybrid bonding is demonstrated. To realize the signal transmission effects in high speed digital signaling via Cu TSV and Cu/Sn micro-joint interconnection, the insertion loss was investigated by simulation analysis with variable TSV pitches, micro-bump diameters and chip thicknesses. Key technologies include TSV fabrication, micro-bumping, hybrid scheme making, hybrid bonding, wafer thinning and backside RDL formation were well developed and integrated to perform the 3D integration scheme. 5 mu m TSV, 10 mu m microbump, 20 mu m pitch, 40 mu m thin wafer, and 250 degrees C low temperature W2W hybrid bonding have been successfully integrated in the integration platform. The 3D scheme was characterized and assessed to have excellent electrical performance and reliability, and is potentially to be applied for 3D product applications.