Browsing by Author "Chen, Chao-Chang A."
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Item type:Item, Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient(2018-09-17) ;Juang, Jing-Ye ;Lu, Chia-Ling ;Chen, Kuan-Ju ;Chen, Chao-Chang A.Hsu, Po-NingA vacuum-free Cu-to-Cu direct bonding by using (111)-oriented and nanotwinned Cu has been achieved. A fast bonding process occurs in 5 min under a temperature gradient between 450 and 100 degrees C. It is verified by grain growth across the bonded interface. To investigate the grain growth behavior, further annealing in the temperature gradient, as well as in a reversed temperature gradient, was performed. They showed similar recrystallization behavior with de-twinning. To analyze the de-twinning, we recall the classic model of annealing twin formation by Fullman and Fisher as comparison. Our case is opposite to the model of Fullman and Fisher. A mechanism of direct bonding by surface diffusion creep is proposed.Item type:Item, Precision Measurement of Sub-50 nm Linewidth by Stitching Double-Tilt Images(2010) ;Pan, Shan-Peng ;Liou, Huay-Chung ;Chen, Chao-Chang A. ;Chen, Jr-RungLiu, Tzong-ShiIn this paper we present a stitching double-tilt image method (SDTIM) to measure sub-50 nm linewidth and to evaluate the measurement uncertainty. The SDTIM employs a parallel image method using a tilt mechanism to obtain two side scans. Moreover, the stitching method is used for linewidth determination. Experiments were performed by atomic force microscopy (AFM) using an ultrasharp tip, whose radius is smaller than 5 nm. The sample rotation axis is set parallel to the top surface of the sample in order to reduce the problem of measurement position variation. Experimental results show that the developed SDTIM can be used with an uncertainty of less than 5 nm at a confidence level of 95%. (C) 2010 The Japan Society of Applied Physics