Browsing by Author "Chen, Chili"

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Fabrication of ordered Ta(2)O(5) nanodots using an anodic aluminum oxide template on Si substrate
(2007-04-01)
Yang, Ching-Jung
;
Chen, Chili
;
Wu, Pu-Wei
;
Shieh, Jia-Min
;
Wang, Shun-Min
Ordered arrays of Ta(2)O(5) nanodots were prepared using anodic aluminum oxide (AAO) as a template to support localized oxidation of TaN. Films of TaN (50 nm) and Al (1.5 mu m) were deposited successively on p-type Si wafers and followed by a two-step anodization process at 40 V using oxalic acid as the electrolyte. The first anodization promoted growth of irregular AAO from overlying Al film. After chemical etching, the second anodization was performed to develop well-organized AAO channels and initiate oxidation of underlying TaN film to form tantalum oxide nanodots at the AAO pore bottoms. X-ray photoelectron spectroscopy results confirmed the chemical nature of nanodots as stoichmetric Ta(2)O(5), X-ray diffraction demonstrated the amorphous characteristic of Ta(2)O(5). As shown in field-emission scanning electron microscopy and transmission electron results, the Ta(2)O(5) nanodots exhibited a hillock structure 80 nm in diameter at the bottom and 50 nm in height. We also synthesized 30-nm nanodots by adjusting AAO formation electrochemistry. This demonstrates the general applicability of the AAO template method for nanodot synthesis from nitride to oxide at a desirable size.
Joule heating effect under accelerated electromigration in flip-chip solder joints
(2006)
Chiu, S. H.
;
Liang, S. W.
;
Chen, Chili
;
Yao, D. J.
;
材料科學與工程學系
This study employs three-dimensional simulation to investigate the Joule heating effect under accelerated electromigration tests in flip-chip solder joints. It was found that the Joule heating effect was very seriously during high current stressing, and a hot spot exists in the solder bump. The hot-spot may play important role in the void formation and thermomigration in solder bumps during electromigration.