Browsing by Author "Chen, Chun"

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A TSV Noise-Aware 3-D Placer
(2015)
Lee, Yu-Min
;
Chen, Chun
;
Song, JiaXing
;
Pan, Kuan-Te
;
交大名義發表
In this work, a three-dimensional partitioning-based force-directed placer is developed to minimize coupling noise between through silicon vias (TSVs) in three-dimensional integrated circuits. TSV decoupling force is introduced and determined by the TSV coupling noise to separate TSVs with strong coupling noise. The experimental results indicate that TSV coupling noise can be effectively reduced by 36.3% on average with only 6.0% wirelength overhead. Besides, the developed 3-D placer shows great performance in wirelength that is competitive to a state-of-the-art 3-D placer.
Hierarchical tensor approximation of multidimensional visual data
(2008-01-01)
Wu, Qing
;
Xia, Tian
;
Chen, Chun
;
Lin, Hsueh-Yi Sean
;
Wang, Hongcheng
Visual data comprise of multiscale and inhomogeneous signals. In this paper, we exploit these characteristics and develop a compact data representation technique based on a hierarchical tensor-based transformation. In this technique, an original multidimensional data set is transformed into a hierarchy of signals to expose its multiscale structures. The signal at each level of the hierarchy is further divided into a number of smaller tensors to expose its spatially inhomogeneous structures. These smaller tensors are further transformed and pruned using a tensor approximation technique. Our hierarchical tensor approximation supports progressive transmission and partial decompression. Experimental results indicate that our technique can achieve higher compression ratios and quality than previous methods, including wavelet transforms, wavelet packet transforms, and single-level tensor approximation. We have successfully applied our technique to multiple tasks involving multidimensional visual data, including medical and scientific data visualization, data-driven rendering, and texture synthesis.
NaPer: A TSV Noise-Aware Placer
(2017-05-01)
Lee, Yu-Min
;
Pan, Kuan-Te
;
Chen, Chun
;
電機工程學系
;
Department of Electrical and Computer Engineering
Through-silicon-via (TSV)-to-TSV coupling issue can degrade the signal integrity in 3-D integrated circuit designs. This paper develops a 3-D partitioning-based force-directed placer, NaPer, to reduce the total coupling noise between TSVs and alleviate the maximum coupling noise between them. We introduce two denoise forces: TSV decoupling force and TSV density force. The TSV decoupling force is determined by the coupling noise between TSVs for separating strong coupling TSVs, and the TSV density force is determined by the TSV density for evenly distributing TSVs. The experimental results show that NaPer can effectively reduce 15.0% total TSV coupling noise and 42.7% maximum TSV coupling noise on average with only 4.5% wirelength overhead. Besides, NaPer also shows great performance in wirelength that is competitive to the state-of-the-art 3-D placer.