Browsing by Author "Chen, Fu-Chian"
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Item type:Item, Low Temperature Cu-to-Cu Direct Bonding with thin gold capping on Highly-orientated Nanotwinned Cu Films(2019-01-01) ;Chen, Fu-Chian ;Wu, Yu-Ting ;Chen, Chih ;材料科學與工程學系Department of Materials Science and EngineeringIn this study, we capped gold on the surface of highly (111)-orientated nano-twin copper films. With the great diffusivity of (111) copper and the low activity in gold, we can achieve a lower bonding temperature.