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Browsing by Author "Chen, Fu-Hsin"

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    Reducing the Thermal Resistance of LED Die-Attach Material Using Ni-Coated Diamond Mixed with Sn-3 wt% Ag-0.5 wt% Cu Solder
    (2015-01-01)
    Chang, Tai-Min
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    Chen, Fu-Hsin
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    Chen, Meng-Yen
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    Wu, YewChung Sermon
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    材料科學與工程學系
    High thermal resistance of LED die-attached (DA) material degraded LED\'s performance. To reduce the DA material resistance, three kinds of diamond particles were used to mix with Sn-3wt%Ag-0.5wt%Cu solder (SAC305) solder. It was found that neither bare diamond particle nor Ti-coated diamond particle could be used. On the other hand, the thermal resistance was reduced by using Ni-coated diamond particle with SAC305. (C) 2015 The Electrochemical Society. All rights reserved.