Browsing by Author "Chen, GL"

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Comparative study of Schottky diode characteristics in Ni, Ta and Ni/Ta metal contact schemes on n-GaN
(2001-07-01)
Chen, GL
;
Chang, FC
;
Chuang, WC
;
Chung, HM
;
Shen, KC
We have reported current-voltage characteristics of Ta/- and Ni/Ta/n-GaN Schottky diodes under various thermal treatments. Experimental data indicate that the electrical characteristics of Ni/Ta diodes are controlled by the interfacial properties of the Ta and GaN heterointerface for the as-deposited samples and strongly affected by the presence of an oxide layer (Ta2O5) in those high-temperature-annealed diodes. In regard to Ta/Ni diodes, probably because of thermal stability and wide-bandgap properties of tantalum oxide, dramatic improvement in Schottky diode performance was resulted after annealing at high temperatures. The corresponding barrier height and ideality factor values can reach 1.17 cV and 1.09, respectively, even at an annealing temperature of 800 degreesC.
Effects of thermal annealing on Ni/Ta/n-GaN Schottky diodes
(2001-03-15)
Chen, GL
;
Chang, FC
;
Chung, WC
;
Huang, BR
;
Chen, WH
The thermal effects of Ni/Ta/n-GaN Schottky diodes have been investigated for the first time using current-voltage, X-ray photoemission spectroscopy and Auger electron spectroscopy (AES) methods. Their barrier height is found to increase monotonously with increasing annealing temperature up to 800 degreesC. Preliminary results indicate that when a Th intermediate layer is added into the Ni/GaN diodes, it can prevent the metal-semiconductor interdiffusion and Ni accumulation adjacent to GaN substrate to a large extent so that a more thermally stable device can be obtained.
Studies of grain size effects in rf sputtered CdS thin films
(1996-06-15)
Tsai, CT
;
Chuu, DS
;
Chen, GL
;
Yang, SL
;
電子物理學系
CdS thin films with various grain sizes were produced by rf sputtering and in situ postannealing processes. For a series of annealing time intervals, the average grain sizes of an as-deposited thin film with thickness similar to 4000 Angstrom were found to vary from similar to 280 to similar to 1500 Angstrom. Three bands located in the green, yellow, and red regions were observed in photoluminescence (PL) spectra of these as-deposited films. The temperature dependence of (PL) spectra of CdS microcrystals was investigated. The variations of the (PL) spectra with average grain size and thickness of CdS thin films were also studied. It was found that the intensity of the yellow band was increased as increasing the film thickness while the intensity of the red band was decreased as the grain size of the film became larger. The peak positions of the yellow and red bands were found to be blue-shifted as the films became thinner. (C) 1996 American Institute of Physics.
Studies of grain size effects in rf sputtered CdS thin films
(1996-06-15)
Tsai, CT
;
Chuu, DS
;
Chen, GL
;
Yang, SL
;
電子物理學系
CdS thin films with various grain sizes were produced by rf sputtering and in situ postannealing processes. For a series of annealing time intervals, the average grain sizes of an as-deposited thin film with thickness similar to 4000 Angstrom were found to vary from similar to 280 to similar to 1500 Angstrom. Three bands located in the green, yellow, and red regions were observed in photoluminescence (PL) spectra of these as-deposited films. The temperature dependence of (PL) spectra of CdS microcrystals was investigated. The variations of the (PL) spectra with average grain size and thickness of CdS thin films were also studied. It was found that the intensity of the yellow band was increased as increasing the film thickness while the intensity of the red band was decreased as the grain size of the film became larger. The peak positions of the yellow and red bands were found to be blue-shifted as the films became thinner. (C) 1996 American Institute of Physics.
Thermal stability study of Ni/Ta n-GaN Schottky contacts
(2002-01-28)
Chen, GL
;
Chang, FC
;
Shen, KC
;
Ou, J
;
Chen, WH
The Schottky behavior of Ni/Ta and Ni contacts on n-GaN was investigated under various annealing conditions by current-voltage measurements. It is found that with the addition of Ta between the Ni layer and the GaN substrate the thermal stability properties of devices can be significantly improved. Experimental results indicate that a high quality Ni/Ta n-GaN Schottky diode with an ideality factor and barrier height of 1.16 and 1.24 eV, respectively, can be obtained under 1 h annealing, at 700 degreesC. (C) 2002 American Institute of Physics.