Browsing by Author "Chen, Wen-Ray"

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High Electron Mobility AlGaN/AlN/GaN HEMT Structure With a Nano-scale AlN Interlayer
(2012-01-01)
Huang, Shih-Chun
;
Chen, Wen-Ray
;
Hsu, Yu-Ting
;
Lin, Jia-Ching
;
Chang, Kuo-Jen
Epitaxies of AlGaN/AlN/GaN high electron mobility transistor (HEMT) structures with different thickness of nano-scale AlN interlayers have been realized by metalorganic chemical vapor deposition (MOCVD) technology. After epitaxy, high resolution X-ray diffraction (HRXRD), temperature-dependent Hall Effect and atomic force microscopy (AFM) measurements were used to characterize the properties of these samples. First, it was found that the Al composition of AlGaN layer increases from 21.6 to 34.2% with increasing the thickness of AlN interlayer from 0 to 5 nm under the same AlGaN growth conditions. This result may due to the influences of compressive stress and Al incorporation induced by the AlN interlayer. Then, we also found that the room-temperature (RT) electron mobility stays higher than 1500 cm(2)/Vs in the samples within AlN interlayer thickness range of 1.5 nm, on the other hand, the low-temperature (80K) electron mobility drops dramatically from 8180 to 5720 cm(2)/Vs in the samples with AlN interlayer thickness increasing from 1 to 1.5 nm. Furthermore, it was found that the two-dimensional electron gas (2DEG) density increases from 1.15x10(13) to 1.58x10(13) cm(-2) beyond the AlN interlayer thickness of 1 nm. It was also found that the temperature-independent 2DEG densities are observed in the samples with AlN interlayer thickness of 0.5 and 1 nm. The degenerated characteristics of the samples with AlN thickness thicker than 1.5 nm show the degraded crystalline quality which matched the observation of surface defects and small cracks formations from their AFM images. Finally, the 2DEG mobilities of the proposed structures can be achieved as high as 1705 and 8180 cm(2)/Vs at RT and 80K, respectively.
Lifetime improvement of organic light emitting diodes using LiF thin film and UV glue encapsulation
(2008-07-01)
Huang, Jian-Ji
;
Su, Yan-Kuin
;
Chang, Ming-Hua
;
Hsieh, Tsung-Eong
;
Huang, Bohr-Ran
This work demonstrates the use of lithium fluoride (LiF) as a passivation layer and newly developed UV glue for encapsulation on the LiF passivation layer to enhance the stability of organic light-emitting devices (OLEDs). Devices with double protective layers showed a 25-fold increase in operational lifetime compared to those without any packaging layers. LiF has a low melting point and insulating characteristics and it can be adapted as both a protective layer and preencapsulation film. The newly developed UV glue has a fast curing time of only 6 s and can be directly spin-coated onto the surface of the LiF passivationlayer. The LiF thin film plus spin-coated UV glue is a simple packaging method that reduces the fabrication costs of OLEDs.