Browsing by Author "Chen, Y. H."

Now showing 1 - 10 of 10

A 45nm dual-port SRAM with write and read capability enhancement at low voltage
(2007)
Wang, D. P.
;
Lia, H. J.
;
Yamauchi, H.
;
Chen, Y. H.
;
Lin, Y. L.
This paper presents circuit techniques to improve write and read capability for dual-port SRAM design fabricated in a 45nm low-power process. The write capability is enhanced by negative write biasing without any reduction in the cell current for the other port. The result shows 12% better improvement with just 1.9% area overhead. This technique has been verified successfully on 65nm and 45nm SRAM chip and improved 120mV lower at 95% yield of minimum operation voltage than a conventional one. The read capability is enhanced by cell current boosting and word line voltage lowering schemes. The SNM is also enhanced significantly. The target is to work below 0.8V with the worst process corner variation.
A note on Group Selection with multiple quality characteristics: power comparison of two methods
(2019-03-04)
Pearn, W. L.
;
Lin, Chen-ju
;
Chen, Y. H.
;
Huang, J. Y.
;
工業工程與管理學系
The Group Selection problem is an essential problem in the supplier selection process. The objective of the problem is to select a subset of suppliers containing the best among multiple candidate suppliers. Manufacturers should procure parts from the selected suppliers to produce high-quality products. Lin, C.J., W.L. Pearn, J.Y. Huang, and Y.H. Chen [2017. "Group Selection for Processes with Multiple Quality Characteristics." Communications in Statistics - Theory and Methods. doi:] considered the problem under multiple quality characteristics, and proposed the Modified Bonferroni method and the Multiple Comparisons with the Best (MCB) method to tackle the problem. The two methods, however, may select different subset containing the best depending on the magnitude of the differences among the k estimated index values. In this paper, we derive the power function for the Modified Bonferroni method, and compare the power of the two methods with extensive simulations. The results show that the MCB method is more powerful than the Modified Bonferroni method when the actual number of the best process is one. On the other hand, the Modified Bonferroni method significantly outperforms the MCB method when the actual number of the best process is greater than one. The results provide practitioners with useful reference about the properties of the two methods for supplier selection.
A solid-state cation exchange reaction to form multiple metal oxide heterostructure nanowires
(2016)
Chen, Y. H.
;
Huang, C. W.
;
Yeh, P. H.
;
Chen, J. Y.
;
Lin, T. Y.
Metal oxide nanostructures have been investigated extensively due to their wide range of physical properties; zinc oxide is one of the most promising materials. It exhibits fascinating functional properties and various types of morphologies. In particular, ZnO heterostructures have attracted great attention because their performance can be modified and further improved by the addition of other materials. In this study, we successfully transformed ZnO nanowires (NWs) into multiple ZnO/Al2O3 heterostructure NWs via a solid-state cation exchange reaction. The experiment was carried out in situ via an ultrahigh vacuum transmission electron microscope (UHV-TEM), which was equipped with a video recorder. Moreover, we analyzed the structure and composition of the heterostructure NWs by Cs-corrected STEM equipped with EDS. Based on these experimental results, we inferred a cation exchange reaction ion path model. Additionally, we investigated the defects that appeared after the cation reaction, which resulted from the remaining zinc ions. These multiple heterostructure ZnO/Al2O3 NWs exhibited excellent UV sensing sensitivity and efficiency.
Constructing and application of multimedia TV-news archives
(2008-10-01)
Pao, H. T.
;
Chen, Y. H.
;
Lai, P. S.
;
Xu, Y. Y.
;
Fu, Hsin-Chia
This paper addresses an integrated information mining techniques for broadcasting TV-news. This utilizes technique from the fields of acoustic, image, and video analysis, for information on news story title, newsman and scene identification. The goal is to construct a compact yet meaningful abstraction of broadcast TV-news, allowing users to browse through large amounts of data in a non-linear fashion with flexibility and efficiency. By adding acoustic analysis, a news program can be partitioned into news and commercial clips, with 90% accuracy on a data set of 400 It TV-news recorded off the air from July 2005 to August 2006. By applying speaker identification and/ or image detection techniques, each news stories can be segmented with a better accuracy of 95.92%. On-screen captions or subtitles are recognized by OCR techniques to produce the text title of each news stories. The extracted title words can be used to link or to navigate more related news contents on the WWW. In cooperation with facial and scene analysis and recognition techniques, OCR results can provide users with multimodal query on specific news stories. Some experimental results are presented and discussed for the system reliability, performance evaluation and comparison. (C) 2007 Published by Elsevier Ltd.
Electrical Performances and Quality Investigations of Integrated Bonded Structures and TSVs for 3D Interconnects
(2012)
Chen, K. N.
;
Chang, Y. J.
;
Ko, C. T.
;
Hsu, S. Y.
;
Chen, H. Y.
Fabrication and characterization of electroplated nanotwinned-copper films on polymer substrates(IMPACT-IAAC 2016)
(2016)
Chang, Liang-Hsien
;
Chen, Chih
;
Hu, Dyi-Chung
;
Tain, Ray
;
Chen, Y. H.
Nanotwinned copper (nt-Cu) is drawing wide attention for it simultaneously demonstrates high strength and high ductility, which are thought to be mutually exclusive. According to previous studies, nanotwinned Cu may be the best structure for resisting electromigration damage. In this study, we deposit (111)-oriented nt-Cu using direct current with suitable additives on PCB substrates. Current density and the plating bath are variables. After copper electroplating, XRD, FIB, EBSD were used to observe the microstructure of the films. We found that the as-deposited Cu has > 30% (111)-oriented nt-Cu on the polymer substrate. The microstructures of the highly (111)-oriented nt-Cu will be presented.
Group selection for processes with multiple quality characteristics
(2018-01-01)
Lin, Chen-ju
;
Pearn, W. L.
;
Huang, J. Y.
;
Chen, Y. H.
;
工業工程與管理學系
Evaluating and comparing process capabilities are important tasks of production management. Manufacturers should apply the process with the highest capability among competing processes. A process group selection method is developed to solve the process selection problem based on overall yields. The goal is to select the processes with the highest overall yield among I processes under multiple quality characteristics, I > 2. The proposed method uses Bonferroni adjustment to control the overall error rate of comparing multiple processes. The critical values and the required sample sizes for designated powers are provided for practical use.
Intramuscular olanzapine versus intramuscular haloperidol plus lorazepam in the treatment of acute agitation in schizophrenia
(2012-10-01)
Hwang, T. J.
;
Chen, Y. H.
;
Huang, L. C.
;
Huang, G. H.
;
Hwu, H. G.
Microstructure and elastic modulus evolution of TiTaNb alloys
(2018-10-01)
Wei, T. Y.
;
Huang, J. C.
;
Chao, Chih-Yeh
;
Wei, L. L.
;
Tsai, M. T.
In order to develop Ti based alloys with promising biocompatibility and matching mechanical response wit} human bone, TiTaNb alloys with 15, 23 and 30 mass% Ta are designed and systematically examined in terms 01 microstructural evolution and mechanical response. The Ti-30mass%Ta-10mass%Nb is demonstrated to be sa tisfactory with an elastic modulus similar to 60 GPa, hardness similar to 3.1 GPa, and strength similar to 1250 MPa. The evolution trenc of the resulting microstructure and phases as a function of Ta content and annealing temperature are established The relationship between the various phase amounts and alloy moduli is explored.
Structural Design, Process, and Reliability of a Wafer-Level 3D Integration Scheme with Cu TSVs Based on Micro-bump/Adhesive Hybrid Wafer Bonding
(2012)
Ko, C. T.
;
Hsiao, Z. C.
;
Chang, Y. J.
;
Chen, P. S.
;
Huang, J. H.
In this study, a wafer-level 3D integration scheme with Cu TSVs based on Cu/Sn micro-bump and BCB adhesive hybrid bonding is demonstrated. To realize the signal transmission effects in high speed digital signaling via Cu TSV and Cu/Sn micro-joint interconnection, the insertion loss was investigated by simulation analysis with variable TSV pitches, micro-bump diameters and chip thicknesses. Key technologies include TSV fabrication, micro-bumping, hybrid scheme making, hybrid bonding, wafer thinning and backside RDL formation were well developed and integrated to perform the 3D integration scheme. 5 mu m TSV, 10 mu m microbump, 20 mu m pitch, 40 mu m thin wafer, and 250 degrees C low temperature W2W hybrid bonding have been successfully integrated in the integration platform. The 3D scheme was characterized and assessed to have excellent electrical performance and reliability, and is potentially to be applied for 3D product applications.