Browsing by Author "Cheng, Y. L."

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Copper voids improvement for the copper dual damascene interconnection process
(2008-02-01)
Wang, T. C.
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Wang, Y. L.
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Hsieh, T. E.
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Chang, S. C.
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Cheng, Y. L.
The mechanism of copper (Cu) voids formation from electro-chemical plating (ECP) followed by Cu chemical mechanical polishing (CMP) are studied in Cu dual-damascene interconnection. The formation of Cu voids at metal lines is the main problem that causes not only the failure of via-induced metal-island corrosion but also yield loss. The galvanic theory and Cu lifting mechanism are proposed to explain the dependence of Cu-void performance on the Cu grain size and the benzotriazole (BTA, C6H5N3) flow rates. In the integration process of Cu interconnects, it is found that the smaller Cu grain size in ECP conditions and less BTA flow rate in CMP processes cannot only reduce the number of Cu voids but also improve the water yield. (c) 2007 Elsevier Ltd. All rights reserved.
Effect of layout on electromigration characteristics in copper dual damascene interconnects
(2014-10-05)
Cheng, Y. L.
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Chang, Y. M.
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Leu, Jihperng
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Bo, T. C.
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Wang, Y. L.
This study demonstrates that the electromigration (EM) behavior of dual damascene Cu lines is strongly affected by the layout which surrounded the tested EM lines, especially for Cu line below 0.10 mu m used for 40 nm or below technologies. The Cu EM lifetime declines as the number of local dummy lines increase, and the global dummy line density increases with the width of the Cu line below 0.063 mu m. This work presents mechanisms of layout effects that explain the EM characteristics and can be exploited to improve the layout effect. Therefore, not only the stressed Cu line structures, but also the surrounding layouts must to be considered in assessing EM reliability of a real IC circuit in 40 nm or below technology. (C) 2014 Elsevier B.V. All rights reserved.
Enhancing Fracture Toughness of Glass/Epoxy Composites for Wind Blades Using Silica Nanoparticles and Rubber Particles
(2011)
Tsai, J. L.
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Huang, B. H.
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Cheng, Y. L.
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機械工程學系
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Department of Mechanical Engineering
The research aims to investigate the interlaminar fracture toughness of glass fiber/epoxy composites, which consist of the silica nanoparticles and the rubber particles. Two kinds of rubber particles, one is the reactive liquid rubber (CTBN) and the other is the core-shell rubber (CSR), were employed to modify the fracture toughness of epoxy resin. In general, the disadvantage of adding rubber particles into polymeric resin is the dramatic reduction of stiffness although the toughness could be modified accordingly. In order to enhance the fracture toughness of the fiber composites without sacrificing their stiffness, the silica nanoparticles in conjunction with the rubber particles were introduced concurrently into the epoxy matrix to form a hybrid nanocomposite. Experimental results obtained from tensile tests on bulk epoxy confirm the presumption that the reduction of the epoxy stiffness because of the presence of rubber particles can be effectively compensated by the silica nanoparticles. Furthermore, the fracture tests conducted on the DCB specimens revealed that the inclusion of silica nanoparticles together with the CSR particle can appreciably increase the fracture toughness of the glass/epoxy composites up to 82%. On the other hand, when the epoxy matrices were modified with CTBN rubber particles and silica nanoparticles, the improvement of the interlaminar fracture toughness was around 48%. (C) 2011 Published by Elsevier Ltd.