Browsing by Author "Chiu, Wei-Chih"

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Characteristics of size dependent conductivity of the CNT-interconnects formed by low temperature process
(2013-06-01)
Chiu, Wei-Chih
;
Tsui, Bing-Yue
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
In this paper, a simple and low temperature fabrication process, slow spin rate coating and dry etching, is proposed to construct the CNT-interconnects for future VLSI interconnect applications. Two sets of CNT-interconnects named width and length varying interconnects were fabricated to investigate the characterization of size dependent conductivity of CNT-interconnects. Not only the amount of the CNT solution spin-coated for forming the CNT networks but also the area of CNT-interconnect regime would affect the conductance, variation, and conductive probability of CNT-interconnects. The yield of working CNT-interconnects does not show direct relation with the conductive probability or the amount of the CNT solution for CNT network formation. Based on the percolation theory, we characterize the average conductance of size-varying CNT-interconnects by three regions: percolation region, power region and linear region. In addition, as the density within a specified CNT-interconnect regime accumulates, the conductive behavior would be eventually characterized as a conventional resistor. (C) 2013 Elsevier Ltd. All rights reserved.
High performance of CNT-interconnects by the multi-layer structure
(2014-04-01)
Chiu, Wei-Chih
;
Tsui, Bing-Yue
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
In this work, we propose two carbon nanotube (CNT) network fabrication processes, the normal spin rate coating (NR) and the slow spin rate coating (SR), and two interconnect structures, the single layer structure (SL) and the double layer structure (DL), to construct CNT-interconnects. We demonstrate and compare the performance of the CNT-interconnects with four kinds of process combinations: NR/SL, NR/DL, SR/SL and SR/DL. Generally, in the midst of these four combinations, the DL samples have higher conductive probabilities and less conductance variations, while SL/SR samples have the higher average conductance under the same amount of the CNT solution for CNT network formation. In addition, the phase transition phenomena occurred in the size dependent average conductance of CNT-interconnects are characterized and investigated by percolation theory. With the elongation of CNT-interconnects, the relationships between the average conductance and the square number would shift from linear region, power region to percolation region. Moreover, the results show that the resistance from the additional layer of Al2O3 in the double layer interconnect structure would influence the phase transition in the conductance of CNT-interconnects as well. (C) 2013 Elsevier Ltd. All rights reserved.
Investigation into the Performance of CNT-Interconnects by Spin Coating Technique
(2013)
Chiu, Wei-Chih
;
Tsui, Bing-Yue
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
In this work, we proposed a simple fabrication process, spin coating and dry etching, to construct CNT-interconnects. The CNT-interconnects formed by the slow rate spin coating method have conductivity of more than 10(2) (Stein) and the CNT-interconnects with 10(2) square numbers possess about 30% conductive probability. In addition, we inserted metal bridges into 1000-mu m-long CNT-interconnects to effectively facilitate the performance.