Browsing by Author "Chou, Cheng-Chuan"

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Automated bonding position inspection on multi-layered wire IC using machine vision
(2010)
Perng, Der-Baau
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Lee, Shu-Ming
;
Chou, Cheng-Chuan
;
工業工程與管理學系
;
Department of Industrial Engineering and Management
No available method can automatically verify the correctness of the wire bonding positions on a multi-layered wire IC. This paper presents a novel method that integrates image processing and wire bonding simulation techniques. The proposed method first takes the IC leadframe image and calculates the lead information before actual wire bonding begins. The wire bonding position information is then generated to simulate the actual wire bonding process. The generated pseudo bonding information is then compared with that from a referential machine. This approach can check the wire bonding position correctness before any actual wire bonding is executed. This approach can fully solve the mal-detection and lost detection problems that may occur in other available methods. The experimental results show that the proposed bonding position check (BPC) method is robust and fast enough for applied multi-layered wire IC inspection synchronously with the wire bonding process.
Design and development of a new machine vision wire bonding inspection system
(2007-09-01)
Perng, Der-Baau
;
Chou, Cheng-Chuan
;
Lee, Shu-Ming
;
工業工程與管理學系
;
Department of Industrial Engineering and Management
In this paper, we developed a fast and robust machine vision system for wire bonding inspection. The defects caused by a bonding wire being broken, lost, shifted, shorted, or sagged in an integrated circuit (IC) chip can be inspected automatically. A new lighting environment was devised which will highlight the slope of the bonding wire and suppress the background from being extracted. First, a set of machine vision algorithms were designed to filter out the defects of broken wire, lost wire, shifted wire, and shorted-out wire. Second, the 3-D type defect of sagged wire can be detected by inspecting the change of the bonding wire slope, derived from a single 2-D image. Some illustrations are given to show the efficiency and effectiveness of the proposed novel wire bonding vision inspection system.
Illumination system for wire bonding inspection
(2007-02-20)
Perng, Der-Baau
;
Chou, Cheng-Chuan
;
Lee, Shu-Ming
;
工業工程與管理學系
;
Department of Industrial Engineering and Management
A novel lighting system was devised for 3D defect inspection in the wire bonding process. Gold wires of 20 mu m in diameter were bonded to connect the integrated circuit (IC) chip with the substrate. Bonding wire defects can be classified as 2D type and 3D type. The 2D-type defects include missed, shifted, or shorted wires. These defects can be inspected from a 2D top-view image of the wire. The 3D-type bonding wire defects are sagging wires, and are difficult to inspect from a 2D top-view image. A structured lighting system was designed and developed to facilitate all 2D-type and 3D-type defect inspection. The devised lighting system can be programmed to turn the structured LEDs on or off independently. Experiments show that the devised illumination system is effective for wire bonding inspection and will be valuable for further applications.