Browsing by Author "Chu, Jinn P."

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Introduction to the Special Issue on the APSPT 2013
(2014-12-01)
Wu, Jong-Shinn
;
Hsu, Cheng-Che (Jerry)
;
Chu, Jinn P.
;
Teii, Kungen
;
機械工程學系
Preface: 7th Vacuum and Surface Sciences Conference of Asia and Australia (VASSCAA-7)
(2015-11-01)
Chu, Jinn P.
;
Hsiung, Gao-Yu
;
Huang, Weixin
;
Luo, Meng-Fan
;
Chiu, Ya-Ping
Preface: the Biennial TACT International Thin Films Conference (TACT 2015)
(2016-11-01)
Huang, Jia-Hong
;
Chang, Li
;
Chu, Jinn P.
;
Huang, Bohr-Ran
;
Hsieh, Jang-Hsing
Titanium-based thin film metallic glass as diffusion barrier layer for PbTe-based thermoelectric modules
(2019-01-01)
Yu, Chia-Chi
;
Wu, Hsin-Jay
;
Agne, Matthias T.
;
Witting, Ian T.
;
Deng, Ping-Yuan
The thin film metallic glass (TFMG) is an effective diffusion barrier layer for PbTe-based thermoelectric (TE) modules. Reaction couples structured with Cu/TFMG/PbTe are prepared via sputter-deposition and are annealed at 673 K for 8-96 h. The transmission line method is adopted for the assessment of electrical contact resistivity upon the PbTe/TFMG, and the value remains in the range of 3.3-2.5 x 10(-9) (Omega m(2)). The titanium-based TFMG remains amorphous upon annealing at 673 K for 48 h and effectively blocks the inter-diffusion by not having grain-boundaries, which only allows the bulk diffusion between the metal electrode and the TE substrate. (C) 2019 Author(s).