Browsing by Author "Chuang, Ying-Shao"
Now showing 1 - 2 of 2
- Results Per Page
- Sort Options
Item type:Item, Analysis of Anomalous Capacitance Induced by TAGIDL in p-Channel LTPS TFTs(2010) ;Lin, Chia-Sheng ;Chen, Ying-Chung ;Chang, Ting-Chang ;Li, Hung-WeiChen, Shih-ChingIn this work, a mechanism of anomalous capacitance in p-channel low temperature polycrystalline silicon thin film transistors (LTPS TFTs) was investigated. In general, the effective capacitance of the LTPS TFTs was only dependent with the overlap area between the gate and source/drain under the off-state. However, the experimental results reveal that the off-state capacitance was increased with decreasing measurement frequency and/or with increasing measurement temperature. By fitting the curve of the drain current vs electric field under off-state region, it was verified that the trap-assisted gate-induced drain leakage (TAGIDL) consists of the Pool-Frenkel emission and thermal field emission. In addition, the charge density calculated from the C(gsd)-V(g) measurement also has the same dependence with electric field. This result demonstrates that the anomalous capacitance is mainly due to the TAGIDL. To suppress the anomalous capacitance, a band-to-band hot electron stress was utilized to reduce the vertical electric field between the gate and the drain. The electric field simulation was also performed by TCAD software. (C) 2010 The Electrochemical Society. [DOI: 10.1149/1.3483759] All rights reserved.Item type:Item, Charge-Trapping-Induced Parasitic Capacitance and Resistance in SONOS TFTs Under Gate Bias Stress(2011-03-01) ;Lin, Chia-Sheng ;Chen, Ying-Chung ;Chang, Ting-Chang ;Jian, Fu-YenLi, Hung-WeiThis letter investigates the charge-trapping-induced parasitic resistance and capacitance in silicon-oxide-nitride-oxide-silicon thin-film transistors under positive and negative dc bias stresses. The results identify a parasitic capacitance in OFF-state C-V curve caused by electrons trapped in the gate insulator near the defined gate region during the positive stress, as well as the depletion induced by those trapped electrons. Meanwhile, the induced depletions in source/drain also degraded the I-V characteristic when the gate bias is larger than the threshold voltage. However, these degradations slightly recover when the trapped electrons are removed after negative bias stress. The electric field in the undefined gate region is also verified by TCAD simulation software.