Browsing by Author "Du, CC"

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Study in IC chip failure during pick-up process by using experimental and finite element methods
(2006-03-10)
Cheng, TH
;
Du, CC
;
Tseng, CH
;
機械工程學系
;
Department of Mechanical Engineering
Stress contours of an IC chip and the displacement contours of the adhesive between an IC chip and blue tape in the pick-up integrated circuit (IC) chip process are obtained using experimental and finite element methods. The physical and mechanical properties of the material used in FEM are determined by pre-experimental tests. Some factors that importantly influence the failure of a pick-up IC chip during the pick-up IC chip process are proposed. The pre-expermiental material properties are manifest in the practical behavior of material, so the post-experimental results are approximately consistent with the FEM results. Post-expermients further demonstrated that the findings of this study can be used to increase the success rate of the pick-up IC chip process. (c) 2005 Elsevier B.V. All rights reserved.