Browsing by Author "Fang, Yu-Siang"

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Heteroepitaxial growth and microwave plasma annealing of DC reactive sputtering deposited TiZrN film on Si (100)
(2020-07-25)
Chiu, Kun-An
;
Fu, Chia-Wei
;
Fang, Yu-Siang
;
Thi Hien Do
;
Shih, Fu-Han
Epitaxial TiZrN films were successfully grown on Si (100) substrates at high temperature by using DC magnetron reactive sputtering with a Ti0.68Zr0.32 alloy target. Annealing of a grown TiZrN/Si specimen was performed by applying microwave plasma with a gas mixture of N-2 and H-2 to improve the film quality. The X-ray rocking curve (XRC) width of (200)(TiZrN) reflection can reach a minimum value of 1.18 degrees. The heteroepitaxial relationship of TiZrN with Si is {001}(TiZrN)//{001}(Si) and < 110 >(TiZrN)//< 110 >(Si). The (200)(TiZrN) XRC width of a 20 nm-thick TiZrN film reduces from 1.99 degrees to 0.85 degrees by microwave plasma annealing. As a result of the improvement of the film quality, the annealed film exhibits a much lower resistivity (28 mu Omega.cm) than that of the as-deposited one (44 mu Omega.cm). The surface morphologies of the TiZrN films are smooth with the surface roughness in the range of 1-2 nm.
Reactive Sputtering Deposition of Epitaxial TiC Film on Si (100) Substrate
(2020-07-01)
Fang, Yu-Siang
;
Thi Hien Do
;
Chiu, Kun-An
;
Chen, Wei-Chun
;
Chang, Li
Epitaxial (100) TiC film deposition on Si (100) substrate by direct current magnetron reactive sputtering of a metallic Ti target with 3%-6% CH4 in Ar gas was investigated. X-ray diffraction and cross-sectional scanning transmission electron microscopy (STEM) reveal that epitaxial cubic TiC can be grown on the Si substrate by domain matching epitaxy in 5/4 ratio with the epitaxial relationship of TiC (100)[0 (1) over bar1] // Si (100)[0 (1) over bar 1]. For sputtering with 3% and 4% CH4, the deposited films are found to consist of both TiC and metallic Ti phases. Increasing the CH4 flow ratio to 5% results in a deposited film completely consisting of TiC without metallic Ti phase. The crystallinity of the deposited TiC is also improved with increasing the CH4 ratio to 5%. X-ray photoelectron spectroscopy shows that the [C]/[Ti] atomic ratio in TiC is nearly close to 1 for growth with 5% CH4 flow ratio and above. The measured electrical resistivities of the deposited films also increase from 41 to 153 mu omega center dot cm with increasing the CH4 ratio from 3% to 6%. With film growth beyond 50 nm thickness, it is shown that some disoriented TiC grains are formed.
Reactive sputtering for highly oriented HfN film growth on Si (100) substrate
(2019-11-15)
Fang, Yu-Siang
;
Chiu, Kun-An
;
Do, Hien
;
Chang, Li
;
材料科學與工程學系
Highly oriented cubic (100) HfN films were grown on Si (100) substrates by direct current magnetron reactive sputtering of a metallic Hf target in an Ar/N-2 gas environment. The influence of N-2 flow ratio on the (100) preferred orientation and crystallinity of the HfN films is investigated. X-ray diffraction shows that not only HEN but also orthorhombic HfSi2 forms in the sputtered films. Increasing the N-2 flow ratio is unfavorable for the formation of HfSi2 while the deposition rate of HfN is decreased. X-ray diffraction and cross-sectional scanning transmission electron microscopy (STEM) reveal that epitaxial orthorhombic HfSi2 can form on the Si substrate, and (100) HfN is in epitaxy with the epitaxial HfSi2. As a result, a (100) oriented HfN film can grow on Si. The epitaxial relationships are shown to be HfN (100)[01 (1) over bar] // HfSi2 (020)[001] // Si (100)[01 (1) over bar] and HfN (100)[01 (1) over bar] // HfSi2 (020)[100] // Si (100)[01 (1) over bar]. Atomically resolved STEM images also show the bonding characteristics across the HfN/HfSi2 and HfSi2/Si interfaces.