Browsing by Author "Fu, H. C."

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Constructing and application of multimedia TV news archives
(2007)
Pao, H. T.
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Xu, Y. Y.
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Chung, S. C.
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Fu, H. C.
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管理科學系
This paper addresses an integrated information mining techniques for broadcasting TV-news. The utilizes technique from the fields of acoustic, image, and video analysis, for information on news title, reporters and news background. The goal is to construct a compact yet meaningful abstraction of broadcast TV news, allowing users to browse through large amounts of data in a non-linear fashion with flexibility and efficiency. By using acoustic analysis, a news program can be partitioned into news and commercial clips, with 90% accuracy on a data set of 400 hours TV-news recorded off the air from July 2005 to August of 2006. By applying additional speaker identification and/or image detection techniques, each news stories can be segmented with a better accuracy of 95.92%. On screen captions and screen characters are recognized by video OCR techniques to produce the title of each news stories. Then keywords can be extracted from title to link related news contents on the WWW. In cooperation with facial and scene analysis and recognition techniques, OCR results can provide users with multimodal query on specific news stories.
Image classification and indexing by EM based multiple-instance learning
(2007)
Pao, H. T.
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Xu, Y. Y.
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Chuang, S. C.
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Fu, H. C.
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管理科學系
In this paper, we propose an EM based Multiple-Instance learning algorithm for the image classification and indexing. To learn a desired image class, a set of exemplar images are selected by a user. Each example is labeled as conceptual related (positive) or conceptual unrelated (negative) image. A positive image consists of at least one user interested object, and a negative example should not contain any user interested object. By using the proposed learning algorithm, an image classification system can learn the user's preferred image class from the positive and negative examples. We have built a prototype system to retrieve user desired images. The experimental results show that for only a few times of relearning, a user can use the prototype system to retrieve favor images from the WWW over Internet.
Structural Design, Process, and Reliability of a Wafer-Level 3D Integration Scheme with Cu TSVs Based on Micro-bump/Adhesive Hybrid Wafer Bonding
(2012)
Ko, C. T.
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Hsiao, Z. C.
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Chang, Y. J.
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Chen, P. S.
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Huang, J. H.
In this study, a wafer-level 3D integration scheme with Cu TSVs based on Cu/Sn micro-bump and BCB adhesive hybrid bonding is demonstrated. To realize the signal transmission effects in high speed digital signaling via Cu TSV and Cu/Sn micro-joint interconnection, the insertion loss was investigated by simulation analysis with variable TSV pitches, micro-bump diameters and chip thicknesses. Key technologies include TSV fabrication, micro-bumping, hybrid scheme making, hybrid bonding, wafer thinning and backside RDL formation were well developed and integrated to perform the 3D integration scheme. 5 mu m TSV, 10 mu m microbump, 20 mu m pitch, 40 mu m thin wafer, and 250 degrees C low temperature W2W hybrid bonding have been successfully integrated in the integration platform. The 3D scheme was characterized and assessed to have excellent electrical performance and reliability, and is potentially to be applied for 3D product applications.