Browsing by Author "Guo, Zi-Li"

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A LOW TEMPERATURE INKJET PRINTING AND FILLING PROCESS FOR LOW RESISTIVE SILVER TSV FABRICATION IN A SU-8 SUBSTRATE
(2017-01-01)
Yang, Tsung-Han
;
Guo, Zi-Li
;
Fu, Yu-Min
;
Cheng, Yu-Ting
;
Song, Yen-Fang
The paper presents a low temperature (with 60 degrees C) inkjet printing and filling process to realize low resistive Ag TSV (Through Substrate Vias) with the aspect ratio of via depth vs. diameter from 2 to 5 in a SU-8 substrate potential for flexible microsystem packaging applications. Combining humidity control and layer-by-layer Ag mirror reaction, the proposed process technology can accomplish a fully filled TSV with the lowest electrical resistivity of similar to 450 mu Omega.cm in comparison with the prior printing and filling technologies.
Characteristic Improvement of Inkjet Printed Ag Interconnects Using Tape On-Off and Mirror-Reaction Processes
(2015)
Guo, Zi-Li
;
Fu, Yu-Min
;
Cheng, Yu-Ting
;
Shew, Bor-Yuan
;
Wu, Pu-Wei
In the paper, we develop and implement the processes of tape on-off and Ag mirror-reaction to the previously developed size scalable inkjet printing process technique, i.e. CPLoP (Combined Process of Lift-off and Printing) for continuing its future interconnect applications in flexible microelectronics. The newly developed processes not only reduce coffee ring effect but also improve better electrical conductivity of the printed Ag interconnects at low process temperature. A 10 mu m wide Ag interconnect with flat surface morphology and low electrical resistivity, i.e. 7.7 mu Omega center dot cm, has been realized.