Browsing by Author "Gusak, A. M."

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A unified model of mean-time-to-failure for electromigration, thermomigration, and stress-migration based on entropy production
(2019-08-21)
Tu, K. N.
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Gusak, A. M.
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國際半導體學院
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International College of Semiconductor Technology
We have revisited Black's equation of mean-time-to-failure (MTTF) for electromigration from the viewpoint that in irreversible processes, entropy production is the controlling behavior. We justify that the power factor on current density is n = 2, as given in the original Black's equation. Furthermore, on the basis of entropy production, we provide a unified model of MTTF for thermomigration and stress-migration. We note that up to now, no MTTF for thermomigration and stress-migration is given. Published under license by AIP Publishing.
Extremely rapid grain growth in scallop-type Cu6Sn5 during solid-liquid interdiffusion reactions in micro-bump solder joints
(2020-04-01)
Gusak, A. M.
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Tu, K. N.
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Chen, Chih
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材料科學與工程學系
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Department of Materials Science and Engineering
In 3D IC technology, when the size of the micro-bump solder joint is reduced to 10 mu m, the scallop-type Cu6Sn5 grains on opposite sides of the joint can interact directly by contacting each other during the solid-liquid interdiffusion reaction. Upon contact, an extremely rapid grain growth of the scallops occurs. We propose that the liquid solder wets the grain boundary between scallops and provides an extremely fast kinetic path of liquid channel for grain growth. The width of the liquid channel has been estimated to be about 1.5 nm. This is a unique phenomenon observed in micro-bump solid joints. (C) 2020 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.