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Browsing by Author "HU, DC"

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    HUMIDITY EFFECT ON POLYIMIDE FILM ADHESION
    (1992-10-01)
    HU, DC
    ;
    CHEN, HC
    ;
    交大名義發表
    ;
    材料科學與工程學系
    ;
    National Chiao Tung University
    A 90-degrees peel tester with substrate heating capability has been built to evaluate the adhesion strength of polyimide film to silicon substrate. The peel strength of polyimide film is not only a function of film thickness or peeling rate, but also a function of ambient humidity. A mechanism is proposed. The peel strength decreases with increasing relative humidity due to the hydrolysis of polyimide, reaches a minimum, and then increases with increasing relative humidity due to the hydrogen bonding at the weak boundary layer. In a high-humidity environment, peel crack tips are attacked by moisture and result in weak adhesion measurement. Water adsorbed by polyimide film near the crack tip and diffused into the peel crack tip is the main mode of moisture attack. The peel behaviour of polyimide film at the elevated temperature is almost the same as peeling at room temperature in a low-humidity environment.
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    TEMPERATURE AND HUMIDITY EFFECTS ON ADHESION OF POLYIMIDE FILM TO A SILICON SUBSTRATE
    (1992)
    HU, DC
    ;
    CHEN, HC
    ;
    交大名義發表
    ;
    材料科學與工程學系
    ;
    National Chiao Tung University
    A 90-degrees peel tester with substrate heating capability was built to evaluate the adhesion strength of polyimide films to a silicon substrate. The effects of polyimide film thickness and peel rate on polyimide adhesion to a silicon substrate under high or low humidity, and at elevated temperatures, have been evaluated. In a high humidity environment, a low peel strength was measured. The influence of moisture on the peel strength increases with decreasing peel rate. Peeling at elevated temperature reduces the moisture effect even under high humidity conditions. Using a low peel rate in a high humidity environment, the measured peel strength showed a maximum as the polyimide film thickness increased. No striations in peeled polyimide films were observed for peeling in a high humidity environment.