Browsing by Author "Haung, Yi-Sa"

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Formation of nearly void-free Cu3Sn intermetallic joints using nanotwinned Cu metallization
(2014-04-28)
Chiu, Wei-Lan
;
Liu, Chien-Min
;
Haung, Yi-Sa
;
Chen, Chih
;
材料科學與工程學系
Cu3Sn intermetallic compounds (IMCs) are more resistant to fracture than solders. In addition, the Cu3Sn IMCs are more conductive than the solders. In this study, we manufactured Cu3Sn IMCs to serve as a joint using electroplated nanotwinned Cu as a metallization layer to react with pure Sn at 260 degrees C and 340 degrees C. The results show that there were almost no Kirkendall voids generated inside the Cu3Sn layer. In addition, the kinetics of the Cu3Sn growth was analyzed to predict the time needed to form the Cu3Sn joint. (C) 2014 AIP Publishing LLC.
Formation of plate-like channels in Cu6Sn5 and Cu3Sn intermetallic compounds during transient liquid reaction of Cu/Sn/Cu structures
(2016-02-01)
Chiu, Wei-Lan
;
Liu, Chien-Min
;
Haung, Yi-Sa
;
Chen, Chih
;
材料科學與工程學系
Transient liquid reactions in Cu/Sn/Cu sandwich structures during various stages were conducted at 340 degrees C. In the early stages of the reaction, Cu atoms dissolved into the molten Sn through the valleys between the scallop-like Cu6Sn5 intermetallic compounds (IMCs). When the Sn layer was almost consumed, formation of plate-like Sn channels in Cu6Sn5 IMCs was observed at later stages of the reaction. In addition, plate-like Cu6Sn5 channels formed in Cu3Sn IMCs because Cu atoms diffused faster in Cu6Sn5 than in Cu3Sn IMCs. These channels serve as fast diffusion paths for Cu to react with the remaining Sn. Hence, the growth kinetics at later stages are quite different from those at the beginning stages. (C) 2015 Elsevier B.V. All rights reserved.