Browsing by Author "Hou, HM"

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A novel modeling technique for efficiently computing 3-D capacitances of VLSI multilevel interconnections BFEM
(1998-01-01)
Hou, HM
;
Sheen, CS
;
Wu, CY
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
An efficient method is presented to model the parasitic three-dimensional (3-D) capacitance of VLSI multilevel interconnections. Based on the boundary-finite-element method (BFEM) of integral formulation, arbitrary triangle elements on the surface of conductors for charge distribution are used to efficiently calculate capacitances of both parallel conductors and complicated configurations such as crossing Lines, corners, contacts, and their combinations, Using an adaptive multilevel Green's function and low-order polynomials as shape function, we apply the Galerkin principle over finite elements, and most of the surface integrals of charge distribution can be evaluated analytically and the singular integrals can be eliminated by choosing proper coordinate transformation, Moreover, an even less complex and more general method for arbitrary geometry configuration of multilevel interconnection lines is proposed in order to Link with the finite element pre-processor in present CAD tools.
A novel transient simulation for 3-D multilevel interconnections on complex topography
(1999-04-01)
Hou, HM
;
Sheen, CS
;
Wu, CY
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
An efficient method is presented to model the transient characteristics of distributed resistor-capacitor of ULSI multilevel interconnections on complex topography, in which the reformulation of the boundary-element method (BEM) and the Pade-via-Lanczos (PVL) algorithm associated with multilayer Green's function can avoid the redundant works on both volume mesh and transient analysis associated with the finite-difference method. An adaptive multilayer Green's function is adopted to investigate several cases that have revealed interesting physical mechanisms in charge transfer between conductors on multilayer topography. To improve the timing analysis efficiency of the finite-difference method, the dominant poles are obtained by introducing the PVL algorithm for model-ol der reduction. Hence, it is easy to calculate the transient characteristics of both parallel conductors and complicated configurations such as crossing lines, corners, contacts, multilayers, and their combinations.
An efficient transient modeling for 3-D multilevel interconnections in a stratified dielectric medium
(1998-10-01)
Wu, CY
;
Hou, HM
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
An efficient method is presented to model the transient characteristics of distributed resistor-capacitor of ULSI multilevel interconnections on complex topography, in which the reformulation of the boundary-element method (BEM) associated with the Padi-via-Lanczos (PVL) algorithm can avoid the redundant works on both volume mesh and transient analysis associated with the finite-difference method. An adaptive multilayer closed-form spatial Green's function for BEM is developed to examine the voltage and current responses of the multilevel conductor system by using the boundary-element method of integral formulation, in which arbitrary triangular elements on the surface of conductors are used to efficiently calculate the free-charge distributions of complex structure based on actual topography/processes. Applying the Galerkin principle over boundary elements, all of the surface integrals of charge distribution have been discretized and evaluated analytically for constant element. To improve the timing-analysis efficiency of the finite-difference method, the dominant poles are obtained by introducing the Pade-via-Lanczos (PVL) algorithm for model-order reduction. Hence, it is easy to calculate the transient characteristics of both parallel conductors and complicated configurations such as crossing lines, corners, contacts, multilayers and their combinations. Therefore, a simple and more general method is proposed for solving the combinations of complex structures based on actual topography/processes and arbitrary geometric configurations of multilevel interconnection lines in order to link with the present CAD tools. (C) 1998 Published by Elsevier Science Ltd. All rights reserved.