Browsing by Author "Hou, Y. T."

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HfSiON n-MOSFETs using low-work function HfSi chi gate
(2006-09-01)
Wu, C. H.
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Hung, B. F.
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Chin, Albert
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Wang, S. J.
;
Yen, F. Y.
The authors have developed a novel high-temperature stable HfSix gate for high-kappa HfSiON gate dielectric. After a 1000 degrees C RTA, the HfSix/HfSiON devices showed an effective work function of 4.27 eV and a peak electron mobility of 216 cm(2)/V (.) s at 1.6-nm equivalent oxide thickness, with additional merit of a process compatible with current very large scale integration fabrication lines.
High-temperature stable HfLaON p-MOSFETs with high-work-function Ir3Si gate
(2007-04-01)
Wu, C. H.
;
Hung, B. F.
;
Chin, Albert
;
Wang, S. J.
;
Wang, X. P.
We report a novel 1000 degrees C stable HfLaON p-MOSFET with Ir3Si gate. Low leakage current of 1.8 x 10(-5) A/cm(2) at 1 V above flat-band voltage, good effective work function of 5.08 eV, and high mobility of 84 cm(2)/V center dot s are simultaneously obtained at 1.6 nm equivalent oxide thickness. This gate-first p-MOSFET process with self-aligned ion implant and 1000 degrees C rapid thermal annealing is fully compatible to current very large scale integration fabrication lines.
High-temperature stable IrxSi gates with high work function on HfSiON p-MOSFETs
(2007-02-01)
Hung, B. F.
;
Wu, C. H.
;
Chin, Albert
;
Wang, S. J.
;
Yen, F. Y.
A novel 1000 degrees C-stable IrxSi gate on HfSiON is shown for the first time with full process compatibility to current very-large-scale-integration fabrication lines and proper effective work function of 4.95 eV at 1.6-nm equivalent-oxide thickness. In addition, small threshold voltages and good hole mobilities are measured in IrxSi/HfSiON transistors. The 1000 degrees C thermal stability above pure metal (900 degrees C only) is due to the inserted 5-nm amorphous Si, which also gives less Fermi-level pinning by the accumulated metallic full silicidation at the interface.
Trapping and de-trapping characteristics in PBTI and dynamic PBTI between HfO2 and HfSiON gate dielectrics
(2008)
Lin, We-Liang
;
Lee, Yao-Jen
;
Lo, Wen-Cheng
;
Chen, King-Sheng
;
Hou, Y. T.
PBTI degradation for HfO2 and HfSiON NMOSFETs has been demonstrated. The generated oxide trap dominated the PBTI characteristics for Hf-based gate dielectrics. In addition, the reduction of Delta V-TH and oxide trap generation under PBTI indicates that the HfSiON is better than HfO2. On the other hand, the electron trapping/de-trapping effect has been investigated. As compared to HfO2 dielectrics, the HfSiON has shallower charge trapping level due to elimination of deep dielectric vacancies, and the temperature effects are quite different between the HfSiON and HfO2 gate dielectrics.