Browsing by Author "Hsia, LC"

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Auger recombination enhanced hot carrier degradation in nMOSFETs with positive substrate bias
(2000)
Chiang, LP
;
Tsai, CW
;
Wang, T
;
Liu, UC
;
Wang, MC
Enhanced hot carrier degradation is observed in DTMOS-like operation mode. This phenomenon is attributed to Auger recombination assisted hot electron process. Measured hot electron gate current and light emission spectrum in nMOSFETs provide evidence that the high-energy tail of channel electrons is increased by the application of a positive substrate bias. As opposed to conventional hot carrier degradation, the Auger enhanced degradation exhibits positive temperature dependence and is more significant at low drain bias.
Valence-band tunneling enhanced hot carrier degradation in ultra-thin oxide nMOSFETs
(2000)
Tsai, CW
;
Gu, SH
;
Chiang, LP
;
Wang, TH
;
Liu, YC
Enhanced hot carrier degradation with stress V-g in the valence-band tunneling regime is observed. This degradation is attributed to channel hole creation by valence-band electron tunneling. The created holes provide for Auger recombination with electrons in the channel and thus increase hot electron energy. The valence-band tunneling enhanced hot carrier degradation becomes more serious as gate oxide thickness is reduced. In ultra-thin gate oxide nMOSFETs, our result shows that the valence-band tunneling enhanced degradation, as opposed to max. Tb stress induced degradation, exhibits positive dependence on substrate bias. This phenomenon may cause a severe reliability issue in positively biased substrate or floating substrate devices.