Browsing by Author "Hsiao, Hsuan-Hsuan"

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A System-Level Thermal Simulator with Automatic Meshing Techniques
(2018-01-01)
Wang, Jui-Hung
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Lee, Yu-Min
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Hsiao, Hsuan-Hsuan
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Cheng, Liang-Chia
;
電機工程學系
The grid structure of most numerical thermal simulators has to be designed artificially. Designers might need to try many different grid structures for getting accurate thermal profiles, and, hence, waste a great of runtime. In order to solve this problem, this work presents a system-level thermal simulator, DeNAFE, which can adaptively mesh thermal grids automatically. First, we develop and employ a fast thermal estimation engine to roughly obtain the thermal profile of the system. Then, with this thermal profile, we propose and utilize an adaptive meshing procedure to decide its grid structure and perform thermal simulation. Compared with a commercial tool, ANSYS Icepak, the experimental results show that the speedup of DeNAFE can be up to two orders of magnitude with only 6: 09% maximum error for all chips in the steady-state thermal simulation. Furthermore, the error of chips is less than 5: 25%, the error of screen/skin is less than 6: 03%, and the speedup can be over 171: 12 times in the transient simulation.
Multi-Angle Bended Heat Pipe Design Using X-Architecture Routing with Dynamic Thermal Weight on Mobile Devices
(2019-01-01)
Hsiao, Hsuan-Hsuan
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Chiou, Hong-Wen
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Lee, Yu-Min
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交大名義發表
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電信工程研究所
Heat pipe is an effective passive cooling technique for mobile devices. This work builds a multi-angle bended heat pipe thermal model and presents an X-architecture routing engine guided by developed dynamic thermal weights to construct the heat pipe path for reducing the operating temperatures of a smartphone. Compared with a commercial tool, the error of the thermal model is only 4.79%. The routing engine can efficiently reduce the operating temperatures of application processors at least 13.20% in smartphones.
Thermal Modeling and Design on Smartphones with Heat Pipe Cooling Technique
(2017-01-01)
Chiou, Hong-Wen
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Lee, Yu-Min
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Hsiao, Hsuan-Hsuan
;
Cheng, Liang-Chia
;
電信工程研究所
While the performance of smartphones becomes much higher, the application processor consumes considerable power. Thus, it is hard to meet thermal constraints by using conventional cooling techniques. Fortunately, since heat pipes can efficiently transfer the thermal energy from hot regions to cool regions, temperatures in hot regions can be reduced greatly. Hence, in the past three years, the heat pipe cooling techniques have been applied to smartphones by industries. However, although the time-consuming commercial simulation tools, such as ANSYS Fluent, can provide accurate thermal maps, they may lead to inefficiency during design stages. Besides, the compact thermal model for bended heat pipes is still underdeveloped. Therefore, efficient thermal simulation for smartphones with bended heat pipes should be developed for the design stage. Furthermore, the routing of bended heat pipe should be optimized to obtain more thermal energy transfer. This work presents a compact thermal model for bended heat pipes and an efficient thermal simulator for smartphones. Moreover, with inconsistent maze routing and dynamic thermal weight assignment, a thermal-driven routing algorithm is proposed for optimizing the design of bended heat pipe. Compared with ANSYS Fluent, the thermal simulation with bended heat pipe thermal model can achieve at least three orders of magnitude speedup with only 3.58% maximum error for all chips. The proposed heat pipe routing algorithm can reduce at least 10.86% of the maximum temperatures for application processors.