Browsing by Author "Hsiao, Sheng-Yi"

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Hydrophobic Templates with Rough Patterns Fabricated by Laser Micromachining for Liquid Droplets Generation
(2011)
Tseng, Shih-Feng
;
Huang, Kuo-Cheng
;
Chiang, Donyau
;
Chen, Ming-Fei
;
Hsiao, Sheng-Yi
This paper presents an approach to utilize high precision pulsed Nd:YAG laser to fabricate a rough array-pattern on a soda-lime glass plate by a laser-induced backside writing (LIBW) process, and a laser-induced plasma assisted ablation (LIPAA) technique. The current study investigates the effect of process parameters such as single-shot laser exposure time and number of passes on the material removal rate. After depositing 695 nm thick Teflon thin film on the glass plate, the surface of the laser micro-machined template becomes hydrophobic. The surface roughness, annular groove profile and surface micrograph were measured by an atomic force microscope, a profilometer, and a scanning electron microscope, respectively. A uniform liquid droplet by the sessile drop method is generated on the hydrophobic template. Droplet characteristics, such as contacted angle, size, and shape, are measured with a surface tension analyzer and microscope. This work also discusses the relationship between the formed droplets and the process recipe of the micro-machined template. The proposed approach can apply to future for uniform lens array formation.
Surface wettability of silicon substrates enhanced by laser ablation
(2010-11-01)
Tseng, Shih-Feng
;
Hsiao, Wen-Tse
;
Chen, Ming-Fei
;
Huang, Kuo-Cheng
;
Hsiao, Sheng-Yi
Laser-ablation techniques have been widely applied for removing material from a solid surface using a laser-beam irradiating apparatus. This paper presents a surface-texturing technique to create rough patterns on a silicon substrate using a pulsed Nd:YAG laser system. The different degrees of microstructure and surface roughness were adjusted by the laser fluence and laser pulse duration. A scanning electron microscope (SEM) and a 3D confocal laser-scanning microscope are used to measure the surface micrograph and roughness of the patterns, respectively. The contact angle variations between droplets on the textured surface were measured using an FTA 188 video contact angle analyzer. The results indicate that increasing the values of laser fluence and laser pulse duration pushes more molten slag piled around these patterns to create micro-sized craters and leads to an increase in the crater height and surface roughness. A typical example of a droplet on a laser-textured surface shows that the droplet spreads very quickly and almost disappears within 0.5167 s, compared to a contact angle of 47.9A degrees on an untextured surface. This processing technique can also be applied to fabricating Si solar panels to increase the absorption efficiency of light.
Surface wettability of silicon substrates enhanced by laser ablation
(2010-11-01)
Tseng, Shih-Feng
;
Hsiao, Wen-Tse
;
Chen, Ming-Fei
;
Huang, Kuo-Cheng
;
Hsiao, Sheng-Yi
Laser-ablation techniques have been widely applied for removing material from a solid surface using a laser-beam irradiating apparatus. This paper presents a surface-texturing technique to create rough patterns on a silicon substrate using a pulsed Nd:YAG laser system. The different degrees of microstructure and surface roughness were adjusted by the laser fluence and laser pulse duration. A scanning electron microscope (SEM) and a 3D confocal laser-scanning microscope are used to measure the surface micrograph and roughness of the patterns, respectively. The contact angle variations between droplets on the textured surface were measured using an FTA 188 video contact angle analyzer. The results indicate that increasing the values of laser fluence and laser pulse duration pushes more molten slag piled around these patterns to create micro-sized craters and leads to an increase in the crater height and surface roughness. A typical example of a droplet on a laser-textured surface shows that the droplet spreads very quickly and almost disappears within 0.5167 s, compared to a contact angle of 47.9A degrees on an untextured surface. This processing technique can also be applied to fabricating Si solar panels to increase the absorption efficiency of light.
Wafer Level Batch Fabrication and Assembly of Small Form Factor Optical Pickup Head
(2008)
Hsiao, Sheng-Yi
;
Lee, Chih-Chun
;
Chiu, Yi
;
Shih, Hsi-Fu
;
Chiou, Jin-Chem
A MEMS batch assembly process for fabricating small form factor optical pickup head is proposed to minimize the complexity of assembly. Electrical and optical components are sealed in a chamber. A silicon optical bench with a packaged laser diode and crystalline-plane mirrors is demonstrated.