Browsing by Author "Hsieh, C. Y."

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A flexible mixed-signal/RF CMOS technology for implantable electronics applications
(2010-04-01)
Hsieh, C. Y.
;
Chen, C. S.
;
Tsou, W. A.
;
Yeh, Y. T.
;
Wen, K. A.
A novel post-CMOS fabrication process has been developed to transform a 0.18 mu m 1P6M mixed-signal/RF CMOS (complementary metal oxide semiconductor)-integrated circuit chips fabricated on an 8 inch SOI (silicon-on-insulator) wafer into flexible devices sandwiched between biocompatible material (10 mu m parylene-C on both sides in this case) and enables future implementation of implantable and fully integrated electronic devices. The functionality of the flexible integrated circuits is demonstrated by a low phase noise RF CMOS VCO (voltage-controlled oscillator) circuit in a ring oscillator configuration that operates at a few hundred MHz to GHz. We report here the associated post-processing technology to make these flexible IC chips and the characterization of both MOS transistors and the demonstration circuit on the flexible IC chip under bending stresses.
A flexible mixed-signal/RF CMOS technology for implantable electronics applications
(2010-04-01)
Hsieh, C. Y.
;
Chen, C. S.
;
Tsou, W. A.
;
Yeh, Y. T.
;
Wen, K. A.
A novel post-CMOS fabrication process has been developed to transform a 0.18 mu m 1P6M mixed-signal/RF CMOS (complementary metal oxide semiconductor)-integrated circuit chips fabricated on an 8 inch SOI (silicon-on-insulator) wafer into flexible devices sandwiched between biocompatible material (10 mu m parylene-C on both sides in this case) and enables future implementation of implantable and fully integrated electronic devices. The functionality of the flexible integrated circuits is demonstrated by a low phase noise RF CMOS VCO (voltage-controlled oscillator) circuit in a ring oscillator configuration that operates at a few hundred MHz to GHz. We report here the associated post-processing technology to make these flexible IC chips and the characterization of both MOS transistors and the demonstration circuit on the flexible IC chip under bending stresses.
Controlled density growth of carbon nanotubes and its improvement on field emission properties
(2004)
Juan, C. P.
;
Tsai, C. C.
;
Chen, K. J.
;
Hong, W. K.
;
Lin, K. C.
The density distribution of the CNTs is one of the crucial parameters for the field emission property of CNTs.We use an inactive thin film layer that was deposited on the catalyst to effectively control the density of the CNTs. The results showed the improved field emission property could be obtained with a thin SiO layer on the catalyst layer as the precursor. For the 3.5 nm Fe and 3.5 nm SiO on 3.5 nm Fe as the catalyst, the turn-on field can be reduced from 3.7 V/ mu m. to 2.2 V/ mu m and the field emission current density increased from 2.6x 10(-8) A/cm(2) to 2.4x 10(-4) A/cm(2) when the applied field was 4 V/mu m. The extremely low turn-on field of 1.3 V/ mu m was also discovered for the CNTs grown with the precursor contained 1.5 nm SiO on 1.5 nm Fe; the extremely high emission current density of 4x 10(-2) A/cm(2) was also achieved under the low electric field of 3.5 V/ mu m.