Browsing by Author "Hsieh, T. -E."

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A study of encapsulation resin containing hexagonal boron nitride (hBN) as inorganic filler
(2006-06-01)
Chiang, Tzu Hsuan
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Hsieh, T. -E.
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材料科學與工程學系
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Department of Materials Science and Engineering
Preparation and property characterization of encapsulation resin contained hexagonal boron nitride (hBN) as inorganic filler were carried out in this work. The dielectric properties, coefficient of thermal expansion (CTE), thermal conductivity, curing kinetics, adhesion strength and viscosity of the resins with the load of hBN filler ranging from 9.2 to 25.7 vol.% (20-70 wt.%) were evaluated. It was found that the dielectric properties of resin containing SiO2 filler are inferior to that containing hBN. Also, the resins possessed lower CTE and the higher T-g when the hBN contents were high (> 15 vol.%) and the resin containing 25.7 vol.% hBN exhibited the largest thermal conductivity of 1.08 W/m K. Adhesion strength of the composite resins decreased with increase of hBN content and the adhesion strength on various substrates was found to be in the order of: alumina > Si wafer > eutectic PbSn solder.
A study of UV-curable epoxide resins containing thermal accelerator - Tertiary amines
(2008-02-01)
Chiang, Tzu Hsuan
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Hsieh, T. -E.
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材料科學與工程學系
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Department of Materials Science and Engineering
The individuals of tertiary amines, including imidazole (1-amine), 1,2-dimethylimidazole (2-amine), 2,4,6-tris(dimethylamino-methyl)phenol (3-amine), 1-methylimidazole (4-amine), and 2-methylimiclazole (5-amine), were added into UV-curable epoxide resins, respectively, and the effects on UV/thermal conversions, thermal properties and adhesion strengths for various types of substrates were investigated. According to the experimental results, the extent of effects of amines on physical properties was found in the order of. 3-amine > 4-amine > I-amine > 2-amine > 5-amine. The resin with 3-amine exhibited the highest glass transition temperature (Tg = 72.3 degrees C) value and the lowest coefficient of thermal expansion (CTE = 70.8 ppm/degrees C), which also exhibited the highest adhesion strengths on various substrates, on glass (greater than 199 kg/cm(2)), ITO (greater than 182 kg/cm(2)), PET (115 kg/cm(2)), and stainless steel (232 kg/cm(2)), and possesses great potentials for advanced opto-electronic applications. (C) 2007 Published by Elsevier Ltd.