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Browsing by Author "Hsieh, WY"

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    Effects of a new combination of additives in electroplating solution on the properties of Cu films in ULSI applications
    (2000-07-01)
    Hu, JC
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    Chang, TC
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    Wu, CW
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    Chen, LJ
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    Hsiung, CS
    Effects of a new combination of additives in acid electroplating solution on the properties of Cu thin films have been investigated, The electroplated Cu films exhibit an excellent superfilling behavior. 0.18 mu m vias with an aspect ratio exceeding 5 were filled completely without any void or seam. Strong (111) texture was found for the electroplated Cu films. The resistivity of a 450-nm-thick Cu film was measured to be 1.84 mu Omega cm. (C) 2000 American Vacuum Society. [S0734-2101(00)08004-0].