Browsing by Author "Hsu, Cho-Lun"
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Item type:Item, Efficiency Enhancement and Sensitive Broadband 1Hz similar to 1kHz of Power Generator by Recycling Vibration Energy on Automobile(2012) ;Wei, Mao-Qugn ;Ko, Fu-Hsiang ;Sun, Tai-Ping ;Chen, Hsuen-LiLin, Yung-BinBased on novel design of moveable magnet between two mutually inimical magnetic forces without strict fabrication, for the first time, we demonstrate successfully a producible power generator with significant efficiency enhancement at broadband frequency range of 1 Hz similar to 1 kHz, 3D-colis stack-ability for output voltage improvement, and recycling vibration energy on automobile simultaneously. Even though the vibration frequency is as low as 1 Hz, two orders-of-magnitude improvements in normalized power (the ratio of power to product of external force and coil turns) provided from previous reports can be obtained. Further, comparing our device with maturely accelerometer chip (MMA7361) indicates that proposed strategies benefit harvesting vibration energy on driving automobile indeed. This vibrated power generator in-turn provides high potential for applications, such as human motion (1 Hz similar to 2 Hz), sporting (5 Hz similar to 10 Hz), and automotive (10 Hz similar to 1 kHz) etc..Item type:Item, MOS2 U-shape MOSFET with 10 nm Channel Length and Poly-Si Source/Drain Serving as Seed for Full Wafer CVD MOS2 Availability(2016) ;Li, Kai-Shin ;Wu, Bo-Wei ;Li, Lain-Jong ;Li, Ming-YangCheng, Chia-Chin KevinA U-shape MOS2 pMOSFET with 10nm channel and poly-Si source/drain is demonstrated. The fabrication process is simple. Because the Si S/D serves as the nucleation seed for CVD MOS2 deposition, thin MOS2 is well deposited in the channel region any where over the fully scale oxide coated Si wafer. This is a big step forward toward a low cost multi-layer stacked TMD IC technology.Item type:Item, Threshold Vacuum Switch (TVS) on 3D-Stackable and 4F(2) Cross-Point Bipolar and Unipolar Resistive Random Access Memory(2012-01-01) ;Ho, ChiaHua ;Huang, Hsin-Hau ;Lee, Ming-Taou ;Hsu, Cho-LunLai, Tung-YenA 3D stackable and bidirectional Threshold Vacuum Switching (TVS) selector using the same WO x material as the RRAM element is reported. It provides the highest reported current density of >10(8) A/cm(2) and the highest selectivity of >10(5). Stress test at high current density indicates >10(8) cycle capability for Reset/Set operation. A mechanism based on recombination of oxygen-ions and vacancies is proposed for the observed volatile switching of TVS. Utilizing the threshold characteristics of the TVS selector, a two-step reading waveform offers potential for 3D-stackable and 4F(2) cross-point RRAM applications.