Browsing by Author "Hsu, JW"

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A study on electrochemical metrologies for evaluating the removal selectivity of AlCMP
(1999)
Chiu, SY
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Hsu, JW
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Tung, IC
;
Shih, HC
;
Feng, MS
The in-situ electrochemical measurements were performed for the Al and Ti disks in the various slurries under the polishing or static condition. The slurries used contained Al2O3 abrasive, phosphoric acid, citric acid and hydrogen peroxide. The results showed that the addition of H2O2 could help to form an effective passivating layer on the Al surface. Besides, the addition of H2O2 enhanced Al dissolution. The maximum corrosion potential drop between the abraded and non-abraded Al electrodes corresponded to the possible maximum polishing rate of Al. The novel equipment for in-situ galvanic measurements was designed for evaluating the Al/Ti galvanic couple. It was found that Al dissolution could be suppressed in the slurry with the addition of 6 vol% H2O2 at pH 4. As regards the Al/Ti removal selectivity, the polishing with the addition of 6 vol% H2O2 at pH 4 would mitigate the Al dishing, since the polishing and dissolution of Al could be suppressed while those of Ti could be enhanced.
Electrochemical behavior of copper chemical mechanical polishing in KIO3 slurry
(2002-03-01)
Hsu, JW
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Chiu, SY
;
Tsai, MS
;
Dai, BT
;
Feng, MS
The electrochemical behavior of polishing copper with colloidal silica abrasive slurry formulated with KIO3 oxidizer has been investigated. For planarization of the surface morphology, the control of the surface passivation of Cu is critical during polishing. KIO3 is not only all oxidizer but also a passivator for copper in an acidic slurry by forming a CuI layer on the surface. With alkaline slurry, Cu2O is the primary corrosion product on the Cu surface. The copper corrosion rate and removal rate can be decreased dramatically with increasing slurry pH. The low corrosion resistance or high corrosion susceptibility of Cu as determined by electrochemical measurements is the basis for the high removal rates. The copper removal rate is reduced from 4600 to 650 Angstrom/min when the slurry pH is increased from 2 to 5: and the copper removal rate levels off atpH 7 with a steady-state removal rate of 200 Angstrom/min, (C) 2002 American Vacuum Society.
Interaction devices and web design for novice older users
(2005-01-01)
Rau, PLP
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Hsu, JW
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傳播研究所
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Institute of Communication Studies
This study investigated the effects of interaction devices on the Internet performance of novice older users, and ways to provide appropriate voice assistance to enhance browsing and searching performance of such users. Three experiments were designed and conducted to test three hypotheses. The results indicated that touch screen and handwriting recognition are better than mouse and keyboard in browsing time in the third trial. Touch screen was also found to be better in terms of performance time for keyword search tasks than mouse and voice input in the second trial, and is better in terms of user error for keyword search tasks than mouse and voice input in the first trial. Learning effects were found for using touch screen and handwriting recognition, and mouse and keyboard for browsing and searching tasks. Furthermore, voice-menu assistance was associated with higher satisfaction for browsing tasks.
The removal selectivity of titanium and aluminum in chemical mechanical planarization
(2002-03-01)
Hsu, JW
;
Chiu, SY
;
Wang, YL
;
Dai, BT
;
Tsai, MS
The removal selectivity control of aluminum and titanium metal barrier during aluminum chemical mechanical polishing in the Damascene process is known to be critical for surface planarity without metal dishing and dielectric erosion. Unfortunately, the electrochemical behaviors of aluminum and titanium are dissimilar, as one may expect. In this study, in situ electrochemical impedance spectroscopy was carried out to investigate the influences of H(2)O(2) concentration, slurry pH, and metal oxide formation through the passivation on aluminum and titanium. As H(2)O(2) concentration increases, the measured impedance of aluminum and titanium decreases, or the oxidation rates of these two metals are enhanced upon increasing the oxidizer concentration. As the slurry pH increases, the removal rate of polished titanium increases, but it decreases for polished aluminum. The removal rate of titanium was limited to its oxidation rate and aluminum was limited to its oxide dissolution rate. (C) 2002 The Electrochemical Society.