Browsing by Author "Hsu, L. H."

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60GHz broadband 0/1-level RF-via interconnect for RF-MEMS packaging
(2007-10-25)
Wu, Wc.
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Hsu, L. H.
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Chang, E. Y.
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Starski, J. P.
;
Zirath, H.
The RF-via interconnect structure front the 0- to the 1-level package for coplanar RF-MEMS devices packaging is evaluated. The 0/1-level interconnect structure was designed and optimised using the electromagnetic simulation tool. The structure was then successfully fabricated and characterised up to 67 GHz. The measured and simulated results show good agreement, demonstrating DC-to-60 GHz broadband interconnect performance through the two levels package with return loss below 15 dB and insertion loss within 0.6 dB.
Coaxial transitions for CPW-to-CPW flip chip interconnects
(2007-08-16)
Wu, W. C.
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Chang, E. Y.
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Huang, C. H.
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Hsu, L. H.
;
Starski, J. P.
A novel coaxial transition for CPW-to-CPW flip chip interconnect is presented and experimentally demonstrated. To realise the coaxial transition on the CPW circuit, benzocyclobutene was used as the interlayer dielectric between the vertical coaxial transition and the CPW circuit. The coaxial interconnect structure was successfully fabricated and RF characterised to 67 GHz. The structure showed excellent interconnect performance from DC up to 55 GHz with low return loss below 20 dB and low insertion loss less than 0.5 dB even when the underfill was applied to the structure.