Browsing by Author "Hsu, SC"

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A robust digital image stabilization technique based on inverse triangle method and background detection
(2005-05-01)
Hsu, SC
;
Liang, SF
;
Lin, CT
;
電控工程研究所
;
Institute of Electrical and Control Engineering
In this paper, a novel robust digital image stabilization (DIS) technique is proposed to stably remove the unwanted shaking phenomena in the image sequences captured by hand-held camcorders without affecting moving objects in the image sequence and intentional motion of panning condition, etc. It consists of a motion estimation unit and a motion compensation unit. To increase the robustness in adverse image conditions, an inverse triangle method is proposed to extract reliable motion vectors in plain images which are lack of features or contain large low-contrast area, etc., and a background evaluation model is developed to deal with irregular images which contain large moving objects, etc. In the motion compensation unit, a CMV estimation method with an inner feedback-loop integrator is proposed to stably remove the unwanted shaking phenomena without losing the effective area of the image in panning condition. We also propose a smoothness index (SI) to quantitatively evaluate the performances of different image stabilization methods. The experimental results are on-line available to demonstrate the remarkable performance of the proposed DIS technique.(1.2).
Effect of the polyimide structure and ZnO concentration on the morphology and characteristics of polyimide/ZnO nanohybrid films
(2005-01-21)
Hsu, SC
;
Whang, WT
;
Hung, CH
;
Chiang, PC
;
Hsiao, KN
A series of polyimide/ZnO nanohybrid films with different ZnO content were prepared from a rigid pyromellitic dianhydride-4,4'-diaminodiphenyl ether (PMDA-ODA) polyimide (PI) and a flexible 3,3,4,4-benzophenonetetracarboxylic acid dianhydride-4,4'-diaminodiphenyl ether (BTDA-ODA) PI with ZnO nanoparticles (3-4 nm). Fourier-transform infrared (FT-IR) and X-ray photoelectron spectroscopy (XPS) depict that the ZnO nanoparticles function as a physical cross-linking agent with PI through hydrogen bonding between the OH on the ZnO nanoparticles and the C=O of the imide groups. ZnO nanoparticles in the rigid PMDA-ODA matrix cause a larger percentage decrease in the coefficient of linear thermal expansion (CTE) than in the flexible BTDA-ODA matrix. The BTDA-ODA/ZnO hybrid films have two transition peaks in dynamic mechanical tan curves, but PMDA-ODA/ZnO hybrid films only have one transition peak. Thermogravimetric analysis reveals that ZnO decreases the thermal degradation temperature (T-d) in both hybrid films, but less so in PMDA-ODA/ZnO films. Trans-mission electron microscopy (TEM) images reveal that the rigid matrix induces larger particle size (30-40 nm) compared to the flexible matrix (10-15 nm).
Electroluminescence characteristics of aromatic polyimides by vapor deposition polymerization
(2003)
Hsu, SC
;
Whang, WT
;
Chen, SC
;
材料科學與工程學系
;
Department of Materials Science and Engineering
Light emitting polyimide (PI) thin films are successfully prepared from two kinds of diamines: 2,5-Bis(4-aminophenyl)-1,3,4-oxadiazole (BAO) and 4,4'-(9-Fluorenylidene)dianiline (BAPF) reacting with 4,4'-(Hexafluoroisopropylidene)diphthalic anhydride (6FDA) by vapor deposition polymerization (VDP). We succeed to reduce the thickness of the thin polyimide film to 150 Angstrom, and the threshold voltage of BAO-6FDA and BAPF-6FDA PI light-emitting diodes to 4.5 V and 6.5 V respectively. The root mean square of the surface roughness of the BAO-6FDA and BAPF-6FDA PI films are 8.8 Angstrom and 4.7 Angstrom respectively. But that of the BAO-6FDA film from wet coating process is 37.1 Angstrom. Apparently, VDP process is the better way to produce smooth polyimide film. The BAO-6FDA LED film emits a broader electroluminscence (EL) band, covering the full range of visible light (400 nm to 700 nm), than the BAPF-6FDA LED. However, the electroluminescence efficiency of BAPF-6FDA LED device is better than BAO-6FDA LED device. It is due to the better balance on the hole and electron injection in the former and better intermolecular charge transfer.
Outsourcing capacity planning for an an IC design house
(2004-08-01)
Lee, CE
;
Hsu, SC
;
工業工程與管理學系
;
Department of Industrial Engineering and Management
The management of outsourcing capacity is one of the key issues for IC design houses. There are two fundamental problems in outsourcing capacity management; they are the estimation of net capacity and the allocation of capacity. The purpose of this paper is to propose a framework of outsourcing capacity planning (OCP) for an IC design house to solve these two problems. The framework of OCP contains three parts: Net IC Product Demand Planning, Net Capacity Demand Planning, and Booking Capacity Planning. Linear Programming (LP) is employed to generate a net IC demand plan. A transformation process that transforms net IC product demand into net capacity demand is applied to obtain the net capacity demand plan. Finally, we use Analytic Hierarchy Process (AHP) to combine the factors, which an IC design house considers for outsourcing, into a Utility Index (U.I.). We then employ U.I. to develop a heuristic method to deal with the booking capacity planning problem. The result of OCP yields a better performance than that of the practice approach. In addition, OCP provides a decision procedure to assist IC design houses in monitoring the performance of each subcontractor.