Browsing by Author "Hu, Cong"

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Large-Scale Transparent Molybdenum Disulfide Plasmonic Photodetector Using Split Bull Eye Structure
(2018-10-18)
Sourav, Adhikary
;
Li, Zhiwen
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Huang, Zhonghui
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Botcha, Venkata Divakar
;
Hu, Cong
A high performance photodetector array on transparent substrate is highly sought after for enabling next-generation imaging technology at the visible wavelengths. 2D materials such as molybdenum disulfide (MoS2) are attractive for such application owing to its superior optoelectronic properties and transparency when scaled to atomic thinness. Here, direct growth of MoS2 on centimeter-scale transparent Al2O3 substrate is reported using a high yield and scalable chemical vapor deposition approach. This enables a large area photodetector array to be demonstrated, wherein aluminum split bull eye (SBE) plasmonic structure is integrated to achieve further performance boost due to surface plasmon resonance (SPR) effect. For a wavelength of 405 nm, the plasmonic MoS2 detector achieves an ultralow noise equivalent power of approximate to 6.2 x 10-14 W Hz(-1/2) and a high responsivity of 7.26 A W-1 at a small bias of 1.0 V, which is more than 6x larger than the reference detector due to SPR effect. Finite-difference time-domain simulation confirms a higher concentration of optical field distribution at the center of the SBE structure, which is responsible for the enhancement of photocurrent and sensitivity even at low-light condition.
Vertical GaN-on-GaN PIN diodes fabricated on free-standing GaN wafer using an ammonothermal method
(2019-10-05)
Chen, Sung-Wen Huang
;
Wang, Hao-Yu
;
Hu, Cong
;
Chen, Yong
;
Wang, Hao
We report vertical GaN-on-GaN PIN diodes with a record high figure-of-merit (V-BR(2)/R-on) of 29.7 GW/cm(2) on free-standing GaN wafer using a complementary metal-oxide-semiconductor (CMOS) compatible contact materials. Due to the low substrate resistivity, low contact resistance, and high quality of GaN drift layer, a low on-state resistance R(on )of 0.31 m Omega cm(2) is obtained. With integrating of the metal filed plate structure in the vertical device, the peak electrical field along the GaN mesa edge can be significantly reduced, thus leading to a high breakdown voltage V-BR of 3.04 kV. The vertical GaN-on-GaN PIN diodes in this work show turn-on voltage V-on of similar to 3.4 V, on/off current ratio of similar to 1.3 x 10(7), and ideal factor n of similar to 2.2. According to the reverse switching measurement, the reverse recovery time T-rr. (reverse recovery charge Q(rr)) is 22.8 ns (4.8 nC) and 24.0 ns (5.4 nC), respectively, under a testing temperature of 300 K and 500 K. (C) 2019 Elsevier B.V. All rights reserved.